SCHEMBL7863827

SCHEMBL7863827

ICCCCCCCCCCCCCCCCCCI

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10960363 1.00
SCHEMBL8971214 1.00
SCHEMBL10982723 1.00
SCHEMBL2734283 1.00
SCHEMBL10959795 1.00
SCHEMBL8970730 1.00
SCHEMBL1460510 1.00
SCHEMBL233429 1.00
SCHEMBL10964189 1.00
SCHEMBL633690 1.00

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0740679-B1 CROSSLINKED POLYMERIC AMMONIUM SALTS DU PONT (US) 2001-08-08 EP claimed
CN-1143379-A Crosslinked polymeric ammonium salts DU PONT (US) 1997-02-19 CN claimed
EP-0740679-A1 CROSSLINKED POLYMERIC AMMONIUM SALTS E.I. DU PONT DE NEMOURS & COMPANY INCORPORATED (US) 1996-11-06 EP claimed
US-5556619-A BILE ACID SEQUESTERANTS TO LOWER BLOOD CHOLESTEROL, POLYAMINES THE DU PONT MERCK PHARMACEUTICAL COMPANY (US) 1996-09-17 US claimed
WO-1995019384-A1 CROSSLINKED POLYMERIC AMMONIUM SALTS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1995-07-20 WO claimed
WO-2020054116-A1 PHOTOPOLYMERIZATION SENSITIZER 川崎化成工業株式会社 2020-03-19 WO disclosed
WO-2020054874-A1 PHOTOPOLYMERIZATION SENSITIZER 川崎化成工業株式会社 2020-03-19 WO disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-20160293445-A1 METHOD OF FORMING FINE PATTERN OF SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-10-06 US disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
US-20160005693-A1 Semiconductor Constructions MICRON TECHNOLOGY, INC. 2016-01-07 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
EP-0493601-B1 LIQUID-CRYSTAL COPOLYMER, PRODUCTION THEREOF, DIENE COMPOUND USED IN SAID PRODUCTION, AND PRODUCTION OF SAID COMPOUND IDEMITSU KOSAN CO (JP) 1996-03-20 EP disclosed
US-5425897-A Electrooptics IDEMITSU KOSAN CO., LTD. (JP) 1995-06-20 US disclosed
US-5380915-A Copolymers of polydimethylsiloxane with diene ethers IDEMITSU KOSAN CO., LTD. (JP) 1995-01-10 US disclosed
US-5281685-A Polyether pendant groups, polysiloxane repeating units IDEMITSU KOSAN CO., LTD. (JP) 1994-01-25 US disclosed
EP-0493601-A1 LIQUID-CRYSTAL COPOLYMER, PRODUCTION THEREOF, DIENE COMPOUND USED IN SAID PRODUCTION, AND PRODUCTION OF SAID COMPOUND IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-07-08 EP disclosed
US-4544505-A Preparation of halo-α-keto-carboxylic acids ETHYL CORPORATION (US) 1985-10-01 US disclosed
EP-0142571-A1 Preparation of bis-alpha-keto-carboxylic acids ETHYL CORPORATION (US) 1985-05-29 EP disclosed
WO-1985002180-A1 PREPARATION OF BIS-alpha-KETO-CARBOXYLIC ACIDS ETHYL CORPORATION (US) 1985-05-23 WO disclosed