SCHEMBL7872216

SCHEMBL7872216

CC1C(C)(C)C(C)(C)C1(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7151760 0.91
SCHEMBL104998 0.75
SCHEMBL24663852 0.64
SCHEMBL12522928 0.64
SCHEMBL8959112 0.64
SCHEMBL11030182 0.64
SCHEMBL23394531 0.64
SCHEMBL13739567 0.61
SCHEMBL13735734 0.61
SCHEMBL13737371 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6303047-B1 Low dielectric constant multiple carbon-containing silicon oxide dielectric material for use in integrated circuit structures, and method of making same LSI LOGIC CORPORATION 2001-10-16 US claimed
EP-1039520-A2 Low dielectric constant carbon-containing silicon oxide dielectric material for use in integrated circuit structures LSI LOGIC CORPORATION (US) 2000-09-27 EP claimed
US-6303047-B1 Low dielectric constant multiple carbon-containing silicon oxide dielectric material for use in integrated circuit structures, and method of making same LSI LOGIC CORPORATION 2001-10-16 US disclosed
EP-1039520-A2 Low dielectric constant carbon-containing silicon oxide dielectric material for use in integrated circuit structures LSI LOGIC CORPORATION (US) 2000-09-27 EP disclosed