SCHEMBL7915308

SCHEMBL7915308

C=C[SiH2]N=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL253042 0.63
SCHEMBL2052242 0.60
SCHEMBL7068166 0.58
SCHEMBL4366194 0.56
SCHEMBL218928 0.56
SCHEMBL2269331 0.56
SCHEMBL1900616 0.56
SCHEMBL1902723 0.56
SCHEMBL29064650 0.54
Formaldehyde SCHEMBL28156076 0.54

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-62007716-A None JP disclosed
US-6207230-B1 IMPREGNATING INORGANIC POROUS SINTERED BODY WITH ORGANOMETALLIC COMPOUND, HEAT-TREATING IMPREGNATED BODY TO DECOMPOSE ORGANOMETALLIC COMPOUND FORMING CARBIDE, NITRIDE, OXIDE, FILLING RESIN IN PORES, CURING MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-03-27 US disclosed
US-4957839-A PROTECTIVE COATING FOR INCREASED DURABILITY RICOH COMPANY, LTD. (JP) 1990-09-18 US disclosed
US-4806422-A ALKOXYSILANE HYDROLYZATE ANTISTICKING LAYER DIAFOIL COMPANY, LIMITED (JP) 1989-02-21 US disclosed
JP-S627716-A NON-AQUEOUS RESIN DISPERSION RICOH CO LTD 1987-01-14 JP disclosed