SCHEMBL7936339

SCHEMBL7936339

CC=C(N)N.[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28482 0.94
Fluoride SCHEMBL21296520 0.89
Bromide SCHEMBL9302184 0.89
Iodide SCHEMBL28805528 0.89
Hydrochloric Acid SCHEMBL8198704 0.89
Hydrochloric Acid SCHEMBL29061470 0.89
Iodide SCHEMBL29191198 0.89
Ethylene SCHEMBL28940091 0.84
Guanidine SCHEMBL8532690 0.80
Ethylene Glycol SCHEMBL4407170 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12460073-B2 Curable resin composition, fuel cell, and sealing method THREEBOND CO., LTD. (JP) 2025-11-04 US disclosed
US-12325811-B2 Radical-polymerizable adhesive composition for laminating and bonding steel plates, adhesive laminate, motor, and method for manufacturing adhesive laminate THREEBOND CO., LTD. (JP) 2025-06-10 US disclosed
US-20250026968-A1 ANAEROBIC CURING ADHESIVE COMPOSITION, BONDED LAMINATED BODY, MOTOR, AND PRIMER COMPOSITION FOR ANAEROBIC CURING TOAGOSEI CO., LTD. (JP) 2025-01-23 US disclosed
US-20250026967-A1 ANAEROBIC CURING ADHESIVE COMPOSITION, BONDED LAMINATED BODY, AND MOTOR NIPPON STEEL CORPORATION (JP) 2025-01-23 US disclosed
EP-4442784-A1 ANAEROBIC CURING-TYPE ADHESIVE COMPOSITION, BONDED LAMINATE, AND MOTOR Toagosei Co., Ltd. (JP) 2024-10-09 EP disclosed
EP-4442783-A1 ANAEROBIC CURING ADHESIVE COMPOSITION, BONDED LAMINATE, MOTOR, AND PRIMER COMPOSITION FOR ANAEROBIC CURING Toagosei Co., Ltd. (JP) 2024-10-09 EP disclosed
US-20240270934-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THREEBOND CO., LTD. (JP) 2024-08-15 US disclosed
WO-2024135438-A1 ANAEROBIC CURING-TYPE ADHESIVE AGENT COMPOSITION, BONDED LAMINATE, AND MOTOR 東亞合成株式会社 2024-06-27 WO disclosed
EP-4353761-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT ThreeBond Co., Ltd. (JP) 2024-04-17 EP disclosed
US-20230340247-A1 CURABLE RESIN COMPOSITION, FUEL CELL, AND SEALING METHOD THREEBOND CO., LTD. (JP) 2023-10-26 US disclosed
US-10774166-B2 Curable resin composition THREE BOND CO., LTD. (JP) 2020-09-15 US disclosed
WO-2020137111-A1 CURABLE RESIN COMPOSITION, FUEL CELL, AND SEALING METHOD 株式会社スリーボンド 2020-07-02 WO disclosed
WO-2020115914-A1 RESIN COMPOSITION, RESIN SHEET, METAL SUBSTRATE, POWER SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR METAL SUBSTRATE 日立化成株式会社 2020-06-11 WO disclosed
WO-2020115913-A1 RESIN SHEET, RESIN COMPOSITION, METAL SUBSTRATE, POWER SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING METAL SUBSTRATE 日立化成株式会社 2020-06-11 WO disclosed
EP-3202796-A1 CURABLE RESIN COMPOSITION Three Bond Co., Ltd. (JP) 2017-08-09 EP disclosed
EP-3165584-A1 POLYMERIZABLE SEALING COMPOSITION Threebond Co., Ltd. (JP) 2017-05-10 EP disclosed
US-20170114251-A1 POLYMERIZABLE SEALING COMPOSITION THREEBOND CO., LTD. (JP) 2017-04-27 US disclosed
EP-1013735-B1 ANAEROBICALLY HARDENABLE SEALING COMPOUND COMPOSITION THREE BOND CO LTD (JP) 2001-10-10 EP disclosed
US-6232431-B1 ACRYLATED POLYURETHANE THREE BOND CO., LTD. (JP) 2001-05-15 US disclosed
EP-1013735-A1 ANAEROBICALLY HARDENABLE SEALING COMPOUND COMPOSITION THREE BOND CO., LTD. (JP) 2000-06-28 EP disclosed