SCHEMBL79688

SCHEMBL79688

COC(C)=C(C)[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1055298 0.74
SCHEMBL11990511 0.74
SCHEMBL1252972 0.74
SCHEMBL660751 0.69
SCHEMBL3439541 0.67
SCHEMBL17235994 0.64
SCHEMBL222498 0.64
SCHEMBL25175282 0.62
SCHEMBL17239065 0.62
SCHEMBL20802161 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 292 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115386087-A Hydrosilylation self-crosslinking self-chain-extension linear polysiloxane and preparation method thereof 广东粤港澳大湾区黄埔材料研究院 2022-11-25 CN claimed
WO-2018048297-A1 ORGANOSILOXANE HYBRID COMPOSITION FOR ENCAPSULATION OF LIGHT-EMITTING ELEMENTS PENCHEM TECHNOLOGIES SDN. BHD. (MY) 2018-03-15 WO claimed
US-9181399-B2 Method for producing polysiloxane TOAGOSEI CO., LTD. (JP) 2015-11-10 US claimed
US-20140303392-A1 METHOD FOR PRODUCING POLYSILOXANE TOAGOSEI CO., LTD. (JP) 2014-10-09 US claimed
US-20070181873-A1 Organic-inorganic hybrid polymer and organic insulator composition having the same and methods thereof SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-08-09 US claimed
US-7172657-B2 Cleaning method of treatment equipment and treatment equipment TOKYO ELECTRON LIMITED (JP) 2007-02-06 US claimed
EP-0854507-B1 Precursor with (alkoxy) (alkyl) vinylsilane ligand to deposit copper and method for the same SHARP KK (JP) 2006-06-07 EP claimed
EP-0852229-B1 Precursor with (methoxy) (methyl) silylolefin ligands to deposit copper and method for the same SHARP KK (JP) 2003-03-05 EP claimed
US-6090960-A CUPROUS (HEXAFLUOROACETYLACETONATE) COMPLEX WITH A METHOXYSILYLOLEFIN SHARP LABORATORIES OF AMERICA, INC. (US) 2000-07-18 US claimed
EP-0854507-A2 Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-22 EP claimed
EP-0852229-A2 Precursor with (methoxy) (methyl) silylolefin ligands to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-08 EP claimed
US-5767301-A COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) 1998-06-16 US claimed
WO-2026105442-A1 COATING FILM, ELECTRONIC DEVICE, MOBILE BODY, AND COATING LIQUID ハドラスホールディングス株式会社 2026-05-21 WO disclosed
US-12610790-B2 Structure including a photoresist underlayer and method of forming same ASM IP HOLDING B.V. (NL) 2026-04-21 US disclosed
EP-4711423-A1 COATING FILM Hardolass Holdings Co.,Ltd. (JP) 2026-03-18 EP disclosed
US-20250389016-A1 GAS BARRIER FILM MATERIAL, SILICON OXIDE FILM, AND PRODUCTION METHOD OF SILICON OXIDE FILM TOSOH CORP (JP) 2025-12-25 US disclosed
EP-0781658-A2 Ink-jet head using sealant and ink-jet apparatus using the ink-jet head CANON KABUSHIKI KAISHA (JP) 1997-07-02 EP disclosed
US-5622784-A WATERPROOFING; MODIFIED SILICON DIOXIDE THIN FILM SEIKO EPSON CORPORATION (JP) 1997-04-22 US disclosed
EP-0648605-A2 Ink jet head and ink jet apparatus employing the same CANON KABUSHIKI KAISHA (JP) 1995-04-19 EP disclosed
US-4599393-A Method for polymerizing lactams and products obtained therefrom GENERAL ELECTRIC COMPANY (US) 1986-07-08 US disclosed