⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Thiourea SCHEMBL11645081 | 1.00 | TSHR (0.60) | — | |
| Thiourea SCHEMBL28098446 | 0.78 | — | — | |
| Thiourea SCHEMBL26660114 | 0.78 | — | — | |
| Thiourea SCHEMBL1008 | 0.78 | — | — | |
| Thiourea SCHEMBL30536984 | 0.78 | — | — | |
| Thiourea SCHEMBL30536978 | 0.78 | — | — | |
| Thiourea SCHEMBL850383 | 0.78 | — | — | |
| SCHEMBL451827 | 0.76 | CA12 (0.44) | — | |
| SCHEMBL760725 | 0.76 | — | — | |
| Thiourea SCHEMBL11650078 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5160422-A | On copper for electronic circuits, thiourea, sulfonates, aluminum chloride | SHIMIZU CO., LTD. (JP) | 1992-11-03 | — | — | US | claimed |
| JP-60089447-A | — | — | None | — | — | JP | disclosed |
| JP-3006357-A | — | — | None | — | — | JP | disclosed |
| EP-3321418-B1 | STAINPROOF FIBER STRUCTURE | TORAY INDUSTRIES (JP) | 2023-04-05 | — | — | EP | disclosed |
| WO-2000010508-A1 | COMPOSITIONS FOR APPLICATION TO KERATINOUS SUBSTRATES AND A METHOD FOR STRENGTHENING SUCH SUBSTRATES | REVLON CONSUMER PRODUCTS CORPORATION (US) | 2000-03-02 | — | — | WO | disclosed |
| US-5993837-A | THIO-FREE KERATINOUS PROTEIN CROSS-LINKING AGENT, WATER, FILM-FORMER | REVLON CONSUMER PRODUCTS (US) | 1999-11-30 | — | — | US | disclosed |
| US-5160422-A | On copper for electronic circuits, thiourea, sulfonates, aluminum chloride | SHIMIZU CO., LTD. (JP) | 1992-11-03 | — | — | US | disclosed |
| JP-H036357-A | DIP SOLDERING BATH | SHIMIZU:KK | 1991-01-11 | — | — | JP | disclosed |
| US-4547363-A | FIRST LIQUID COMPONENT CONTAINING DIMETHYLOL ETHYLENE THEOPHYLLINESTABILIZER AND SOLVENTS; SECOND CONTAINING CATALYST AND AMINOACETICACID | JOOS BERNHARD (CH) | 1985-10-15 | — | — | US | disclosed |
| JP-S6089447-A | METHOD OF PREVENTING POLYMERIZATION OF (METH)ACRYLIC ACID ESTER MONOMER | MITSUBISHI GAS CHEM CO INC | 1985-05-20 | — | — | JP | disclosed |
| US-4197124-A | SILVER OR COPPER AND SULFUR, SELENIUM OR TELLURIUM0 | FUJI PHOTO FILM CO., LTD. (JP) | 1980-04-08 | — | — | US | disclosed |
| US-4115364-A | MELT SPINNING WITH A THERMOPLASTIC NYLON, CURING, REACTING WITH UREA COMPOUND | NIPPON KYNOL INCORPORATED (JP) | 1978-09-19 | — | — | US | disclosed |
| US-4038198-A | STORAGE STABLE MULTICOMPONENT MIXTURES USEFUL IN MAKING AMINOPLASTS, PHENOPLASTS, AND POLYURETHANES | BAYER AKTIENGESELLSCHAFT (DT) | 1977-07-26 | — | — | US | disclosed |