⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19335038 | 0.76 | — | — | |
| SCHEMBL5950782 | 0.76 | — | — | |
| SCHEMBL14470625 | 0.76 | — | — | |
| SCHEMBL319924 | 0.76 | — | — | |
| SCHEMBL16808523 | 0.76 | — | — | |
| SCHEMBL13093541 | 0.76 | — | — | |
| SCHEMBL10250236 | 0.76 | — | — | |
| SCHEMBL826310 | 0.76 | — | — | |
| SCHEMBL319925 | 0.76 | — | — | |
| SCHEMBL1251003 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20170372892-A1 | Gap Filling Materials and Methods | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2017-12-28 | — | — | US | disclosed |
| US-9761449-B2 | Gap filling materials and methods | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2017-09-12 | — | — | US | disclosed |
| US-9761449-B2 | Gap filling materials and methods | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2017-09-12 | — | — | US | disclosed |
| US-9543147-B2 | Photoresist and method of manufacture | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2017-01-10 | — | — | US | disclosed |
| US-9543147-B2 | Photoresist and method of manufacture | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2017-01-10 | — | — | US | disclosed |
| US-9502231-B2 | Photoresist layer and method | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-11-22 | — | — | US | disclosed |
| US-9502231-B2 | Photoresist layer and method | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-11-22 | — | — | US | disclosed |
| US-9460909-B2 | Method for manufacturing semiconductor device | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-10-04 | — | — | US | disclosed |
| US-9460909-B2 | Method for manufacturing semiconductor device | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-10-04 | — | — | US | disclosed |
| US-20160155626-A1 | Method for Manufacturing Semiconductor Device | TAIWAN SEMICONDUCTOR MFG (TW) | 2016-06-02 | — | — | US | disclosed |
| US-9256128-B2 | Method for manufacturing semiconductor device | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-02-09 | — | — | US | disclosed |
| US-20160005595-A1 | Photoresist and Method of Manufacture | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-01-07 | — | — | US | disclosed |
| US-20160005595-A1 | Photoresist and Method of Manufacture | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-01-07 | — | — | US | disclosed |
| US-20150187565-A1 | Gap Filling Materials and Methods | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2015-07-02 | — | — | US | disclosed |
| US-20150187565-A1 | Gap Filling Materials and Methods | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2015-07-02 | — | — | US | disclosed |
| US-20150111384-A1 | Anti-Reflective Layer and Method | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2015-04-23 | — | — | US | disclosed |
| US-20150111384-A1 | Anti-Reflective Layer and Method | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2015-04-23 | — | — | US | disclosed |
| US-6262073-B1 | INHIBITING THE ACTION OF A PRO-INFLAMMATORY CYTOKINE | OXIS INTERNATIONAL INC. | 2001-07-17 | — | — | US | disclosed |
| US-6136832-A | RACEMIC MIXTURES AND ENANTIOMORPHS | OXIS INTERNATIONAL INC. (US) | 2000-10-24 | — | — | US | disclosed |
| US-6005000-A | 5,5-Disubstituted-3, 4-dihydroxy-2(5H)-furanones and methods of use therefor | OXIS INTERNATIONAL, INC. (US) | 1999-12-21 | — | — | US | disclosed |