SCHEMBL7994411

SCHEMBL7994411

O=C(O)C1=CC(C(=O)O)(C(F)(F)F)C(C(=O)O)=CC1(F)C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8006588 0.89
SCHEMBL8010477 0.86
SCHEMBL7749991 0.82
SCHEMBL8006963 0.80
SCHEMBL7994601 0.73
SCHEMBL8006705 0.73
SCHEMBL8007590 0.71
SCHEMBL8006357 0.69
SCHEMBL14322146 0.68
SCHEMBL14322162 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117202984-A Polyimide porous film 东京应化工业株式会社 2023-12-08 CN disclosed
WO-2022230546-A1 POROUS POLYIMIDE FILM 東京応化工業株式会社 2022-11-03 WO disclosed
US-20150203652-A1 METAL FINE-PARTICLE COMPOSITE AND METHOD FOR FABRICATING THE SAME TOKYO INST TECH (JP) 2015-07-23 US disclosed
EP-2579022-A1 METAL MICROPARTICLE COMPOSITE AND METHOD FOR PRODUCING THE SAME Tokyo Institute of Technology (JP) 2013-04-10 EP disclosed
US-20130071619-A1 METAL FINE-PARTICLE COMPOSITE AND METHOD FOR FABRICATING THE SAME NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2013-03-21 US disclosed
US-6115514-A FILM THICKNESS OF POLYIMIDE FILM FORMED BY THERMALLY IMIDIZING A POLYAMIC ACID IS SET AT NOT MORE THAN 20 MICROMETERS; HUMIDITY RESISTANCE, STRENGTH, FLEXIBILITY NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2000-09-05 US disclosed
US-6072920-A Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2000-06-06 US disclosed
US-6048986-A DEHYDRATION OF DIFLUOROPYROMELLITIC ACID TO FORM DIFLUOROPYROMELLITIC DIANHYDRIDE NIPPON TELEGRAPH AND TELEPHONE CORP. (JP) 2000-04-11 US disclosed
EP-0623830-B1 Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH & TELEPHONE (JP) 1999-08-18 EP disclosed
US-5901259-A Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1999-05-04 US disclosed
US-5849934-A Method for preparing aromatic compounds NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1998-12-15 US disclosed
US-5750731-A POLYIMIDE ANHYDRIDE MONOMERS NIPPON TELEGRAPH & TELEPHONE CORPORATION (JP) 1998-05-12 US disclosed
US-5694496-A WAVEGUIDE COMPRISING AN AROMATIC FLUORO-POLYIMIDE; HEAT RESISTANCE, FLEXIBILITY, WATERPROOFING, STRENGTH NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1997-12-02 US disclosed
EP-0480266-B1 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH & TELEPHONE (JP) 1996-06-26 EP disclosed
US-5449741-A Electronics with impact strength NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1995-09-12 US disclosed
EP-0623830-A1 Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1994-11-09 EP disclosed
US-5233018-A Heat resistance and low optical transmission loss in the near-infrared region; integrated circuits NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1993-08-03 US disclosed
EP-0480266-A2 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-04-15 EP disclosed