SCHEMBL8021816

SCHEMBL8021816

CCCC1CCC(c2ccc(O)cc2)(c2ccc(O)cc2)CC1

nearest known ligand 0.50

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 9/20 0.50
ESR1 P03372 4/20 0.50
FYN P06241 1/20 0.37
CYP2C9 P11712 1/20 0.36
OPRM1 P35372 1/20 0.34
OPRK1 P41145 1/20 0.34
OPRL1 P41146 1/20 0.34
ALDH1A1 P00352 1/20 0.34
LMNA P02545 1/20 0.34
MAPT P10636 1/20 0.34
SHBG P04278 1/20 0.34
MEN1 O00255 1/20 0.34
MAPK1 P28482 1/20 0.34
KMT2A Q03164 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9354045 0.97 ESR2 (0.47) ESR2ESR1FYNCYP2C9OPRM1
SCHEMBL9354044 0.97 ESR2 (0.47) ESR2ESR1FYNCYP2C9OPRM1
SCHEMBL9352649 0.91 ESR2 (0.44) ESR2ESR1FYNCYP2C9OPRM1
SCHEMBL9352594 0.91 ESR2 (0.44) ESR2ESR1FYNCYP2C9OPRM1
SCHEMBL9352604 0.91 ESR2 (0.44) ESR2ESR1FYNCYP2C9OPRM1
SCHEMBL4059964 0.90 ESR1 (0.47) ESR2ESR1CYP2C9ALDH1A1LMNA
SCHEMBL20763440 0.90 ESR2 (0.43) ESR2ESR1FYNOPRK1SHBG
SCHEMBL9350794 0.89 ESR1 (0.46) ESR2ESR1ALDH1A1LMNASHBG
SCHEMBL9353974 0.88 ESR2 (0.48) ESR2ESR1CYP2C9OPRM1OPRK1
SCHEMBL9353981 0.88 ESR2 (0.48) ESR2ESR1CYP2C9OPRM1OPRK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5041523-A Interfacial polycondensation using divalent phenol and branching agent IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1991-08-20 US claimed
EP-3727851-A1 PLASTIC FILMS FOR ID DOCUMENTS WITH BETTER LIGHTNESS OF EMBOSSED HOLOGRAMS Covestro Deutschland AG (DE) 2020-10-28 EP disclosed
CN-110300757-A With phosphonate oligomers cured epoxy resin FRX 聚合物股份有限公司 2019-10-01 CN disclosed
CN-105473342-B For secure file and/or the data page of valuable document 联邦印刷厂有限公司 2018-11-20 CN disclosed
CN-106459574-A Thermoplastic resin composition and molded product thereof UMG ABS 株式会社 2017-02-22 CN disclosed
EP-0973820-A1 METHOD OF MAKING POLYCARBONATE PREPOLYMER AND METHOD OF MAKING HIGH MOLECULAR WEIGHT POLYCARBONATE THE DOW CHEMICAL COMPANY (US) 2000-01-26 EP disclosed
US-5849414-A Production of scratch-resistant polycarbonate moulded parts BAYER AG (DE) 1998-12-15 US disclosed
US-5840454-A Aromatic polycarbonate and electrophotographic photosensitive medium using same RICOH COMPANY, LTD. (JP) 1998-11-24 US disclosed
WO-1998045351-A1 METHOD OF MAKING POLYCARBONATE PREPOLYMER AND METHOD OF MAKING HIGH MOLECULAR WEIGHT POLYCARBONATE THE DOW CHEMICAL COMPANY (US) 1998-10-15 WO disclosed
US-5767224-A MELT ESTERIFICATION OF DIPHENOLS AND CARBOXYLIC ACID DIARYL ESTERS IN THE PRESENCE OF CATALYSTS AND BRANCHING AGENTS BAYER AKTIENGESELLSCHAFT (DE) 1998-06-16 US disclosed
EP-0368604-B1 New diamino and dinitro compounds and a process for preparing the diamino compounds CHISSO CORP (JP) 1994-08-31 EP disclosed
US-5008456-A Chemical intermediates for polyamides and polyimides CHISSO CORPORATION (JP) 1991-04-16 US disclosed
EP-0368604-A2 New diamino and dinitro compounds and a process for preparing the diamino compounds CHISSO CORPORATION (JP) 1990-05-16 EP disclosed