⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28461465 | 0.87 | — | — | |
| SCHEMBL29111083 | 0.87 | — | — | |
| SCHEMBL273054 | 0.82 | — | — | |
| SCHEMBL4519242 | 0.82 | — | — | |
| SCHEMBL8012598 | 0.82 | — | — | |
| SCHEMBL23282567 | 0.82 | — | — | |
| SCHEMBL8839025 | 0.82 | — | — | |
| SCHEMBL8657295 | 0.82 | — | — | |
| SCHEMBL7946155 | 0.82 | — | — | |
| SCHEMBL4779950 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110331292-A | A kind of method of refining of stanniferous copper scap | 北京科技大学 | 2019-10-15 | — | — | CN | claimed |
| CN-110331292-A | A kind of method of refining of stanniferous copper scap | 北京科技大学 | 2019-10-15 | — | — | CN | disclosed |
| CN-110331292-A | A kind of method of refining of stanniferous copper scap | 北京科技大学 | 2019-10-15 | — | — | CN | disclosed |
| US-10056320-B2 | Ceramic capacitors with improved lead designs | KEMET ELECTRONICS CORPORATION (US) | 2018-08-21 | — | — | US | disclosed |
| EP-3063778-A1 | CERAMIC CAPACITORS WITH IMPROVED LEAD DESIGNS | Kemet Electronics Corporation (US) | 2016-09-07 | — | — | EP | disclosed |
| US-20150114697-A1 | Ceramic Capacitors with Improved Lead Designs | KEMET ELECTRONICS CORPORATION | 2015-04-30 | — | — | US | disclosed |
| US-6081416-A | Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic | PRESIDIO COMPONETS, INC. | 2000-06-27 | — | — | US | disclosed |