⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Thiosulfuric Acid SCHEMBL3693435 | 0.95 | MEN1 (0.46) | — | |
| Thiosulfuric Acid SCHEMBL17956913 | 0.95 | — | — | |
| Thiosulfuric Acid SCHEMBL3692088 | 0.95 | MEN1 (0.36) | — | |
| Thiosulfuric Acid SCHEMBL927014 | 0.89 | — | — | |
| Thiosulfuric Acid SCHEMBL193572 | 0.89 | — | — | |
| Thiosulfuric Acid SCHEMBL193983 | 0.89 | — | — | |
| Thiosulfuric Acid SCHEMBL2403076 | 0.89 | — | — | |
| Thiosulfuric Acid SCHEMBL3380343 | 0.89 | — | — | |
| Thiosulfuric Acid SCHEMBL167837 | 0.89 | — | — | |
| Thiosulfuric Acid SCHEMBL21531353 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118204074-A | Cyclic ether MOF stabilized solitary atom catalyst and preparation and application thereof | 中国科学院大连化学物理研究所 | 2024-06-18 | — | — | CN | claimed |
| CN-109719304-B | Method for preparing noble metal lone atoms in solution and application | 中国科学院大连化学物理研究所 | 2022-08-09 | — | — | CN | claimed |
| CN-108138346-B | Electroplating bath for the electrochemical deposition of a Cu-Sn-Zn-Pd alloy, method for the electrochemical deposition of said alloy, substrate comprising said alloy and use of the substrate | 科文特亚股份公司 | 2021-03-05 | — | — | CN | claimed |
| EP-3356579-B1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE | COVENTYA S P A (IT) | 2020-03-11 | — | — | EP | claimed |
| EP-3150744-B1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE | COVENTYA S P A (IT) | 2020-02-12 | — | — | EP | claimed |
| EP-3356579-A1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE | Coventya S.p.A. (IT) | 2018-08-08 | — | — | EP | claimed |
| EP-3150744-A1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE | COVENTYA S.p.A. (IT) | 2017-04-05 | — | — | EP | claimed |
| CN-109719304-B | Method for preparing noble metal lone atoms in solution and application | 中国科学院大连化学物理研究所 | 2022-08-09 | — | — | CN | disclosed |
| US-11389875-B2 | Process for producing nickel powder | SUMITOMO METAL MINING CO., LTD. (JP) | 2022-07-19 | — | — | US | disclosed |
| CN-110049840-B | Method for producing nickel powder | 住友金属矿山株式会社 | 2022-06-24 | — | — | CN | disclosed |
| CN-108138346-B | Electroplating bath for the electrochemical deposition of a Cu-Sn-Zn-Pd alloy, method for the electrochemical deposition of said alloy, substrate comprising said alloy and use of the substrate | 科文特亚股份公司 | 2021-03-05 | — | — | CN | disclosed |
| EP-3356579-B1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE | COVENTYA S P A (IT) | 2020-03-11 | — | — | EP | disclosed |
| EP-3150744-B1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE | COVENTYA S P A (IT) | 2020-02-12 | — | — | EP | disclosed |
| EP-3150744-A1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE | COVENTYA S.p.A. (IT) | 2017-04-05 | — | — | EP | disclosed |
| US-6036835-A | EXPOSING COPPER UNDERLYING THE ELECTROCONDUCTIVE POLYMER BY REMOVING POLYMER WITH MIXTURE OF HYDROGEN PEROXIDE, SULFURIC AND CARBOXYLIC ACIDS BEFORE ELECTROPLATING THROUGH HOLES CONNECTING METAL LAYERS OF A PRINTED CIRCUIT BOARD | SHIPLEY COMPANY, L.L.C. (US) | 2000-03-14 | — | — | US | disclosed |
| US-3980531-A | ALKALI THIOSULFATE | SCHERING AKTIENGESELLSCHAFT (DT) | 1976-09-14 | — | — | US | disclosed |