Ether

Ether

SCHEMBL8042799

CCOCC.CCc1ccccc1O

nearest known ligand 0.50

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSPA5 P11021 1/20 0.50
AKR1B1 P15121 1/20 0.48
GABRA1 P14867 1/20 0.48
GABRB2 P47870 1/20 0.48
IDO1 P14902 2/20 0.47
TSHR P16473 2/20 0.45
CYP2D6 P10635 1/20 0.45
HIF1A Q16665 1/20 0.45
HTR1A P08908 1/20 0.44
CA12 O43570 3/20 0.44
CA2 P00918 3/20 0.44
CA9 Q16790 2/20 0.44
CA1 P00915 1/20 0.44
CA7 P43166 1/20 0.44
CA14 Q9ULX7 1/20 0.44
TAAR1 Q96RJ0 1/20 0.43
MAPT P10636 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
MPO P05164 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ether SCHEMBL20774486 0.96 HSPA5 (0.46) HSPA5AKR1B1GABRA1GABRB2IDO1
SCHEMBL29402855 0.89
SCHEMBL51108 0.89
SCHEMBL27808385 0.86 HSPA5 (0.59) HSPA5AKR1B1GABRA1GABRB2IDO1
Ammonia Solution, Strong SCHEMBL267493 0.86 HSPA5 (0.59) HSPA5AKR1B1GABRA1GABRB2IDO1
SCHEMBL7392161 0.86 HSPA5 (0.59) HSPA5AKR1B1GABRA1GABRB2IDO1
SCHEMBL27712318 0.86 HSPA5 (0.59) HSPA5AKR1B1GABRA1GABRB2IDO1
Benzene SCHEMBL27843896 0.86 AKR1B1 (0.62) HSPA5AKR1B1GABRA1GABRB2IDO1
SCHEMBL27541365 0.86 HSPA5 (0.59) HSPA5AKR1B1GABRA1GABRB2IDO1
SCHEMBL27511484 0.86 HSPA5 (0.59) HSPA5AKR1B1GABRA1GABRB2IDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6162892-A Gas barrier composition and molded resin DOW CORNING TORAY SILICONE CO., LTD. (JP) 2000-12-19 US disclosed
EP-0990671-A1 Gas barrier composition and molded resin Dow Corning Toray Silicone Company, Ltd. (JP) 2000-04-05 EP disclosed