SCHEMBL80717

SCHEMBL80717

COCC(C)(OC)OC(=O)OOC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL80716 0.92
SCHEMBL5200345 0.89
SCHEMBL831431 0.83
SCHEMBL831432 0.79
SCHEMBL29737383 0.79
SCHEMBL811662 0.76
SCHEMBL9849589 0.74
SCHEMBL7674315 0.74 GAA (0.41)
SCHEMBL8389793 0.71 HCAR2 (0.37)
Hydrogen Peroxide SCHEMBL26665096 0.71 ELANE (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 582 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117467267-A High-frequency high-speed resin composition and application thereof 广东生益科技股份有限公司 2024-01-30 CN claimed
CN-111372372-B Circuit material and circuit board comprising same 广东生益科技股份有限公司 2023-12-22 CN claimed
CN-111253702-B Resin composition, prepreg and circuit material using same 广东生益科技股份有限公司 2023-06-06 CN claimed
CN-112724640-B Thermosetting resin composition, prepreg using same and copper-clad laminate 广东生益科技股份有限公司 2022-09-16 CN claimed
CN-112724640-A Thermosetting resin composition, prepreg using same and copper-clad laminate 广东生益科技股份有限公司 2021-04-30 CN claimed
CN-111393724-A Resin composition, and prepreg and circuit material using same 广东生益科技股份有限公司 2020-07-10 CN claimed
CN-111372372-A Circuit material and circuit board comprising same 广东生益科技股份有限公司 2020-07-03 CN claimed
CN-111253888-A Circuit material and circuit board comprising same 广东生益科技股份有限公司 2020-06-09 CN claimed
CN-111253702-A Resin composition, and prepreg and circuit material using same 广东生益科技股份有限公司 2020-06-09 CN claimed
US-7226701-B2 Polymer electrolyte with effective leakage resistance and lithium battery using the same SAMSUNG SDI CO., LTD. (KR) 2007-06-05 US claimed
US-20030232240-A1 Polymer electrolyte with effective leakage resistance and lithium battery using the same SAMSUNG SDI CO., LTD (KR) 2003-12-18 US claimed
US-4788015-A CASTING, CURING LIQUID RESIN TO FORM CONCENTRIC GUIDE GROOVES DAINIPPON INK AND CHEMICAL INC. (JP) 1988-11-29 US claimed
US-4370467-A CYANATE, PEROXIDE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-01-25 US claimed
JP-4285602-A None JP disclosed
US-20260147286-A1 TONER CANON KABUSHIKI KAISHA (JP) 2026-05-28 US disclosed
US-20260118789-A1 TONER, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS CANON KK (JP) 2026-04-30 US disclosed
US-4436861-A MOLDING MATERIALS OF EXCELLENT PROCESSABILITY KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-03-13 US disclosed
US-4370467-A CYANATE, PEROXIDE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-01-25 US disclosed
EP-0061133-A1 Improved polyvinyl chloride and preparation thereof KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1982-09-29 EP disclosed
EP-0061134-A1 Improved polyvinyl chloride and preparation thereof KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1982-09-29 EP disclosed