SCHEMBL80808

SCHEMBL80808

CC(C)N[SiH2]NC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14125875 0.70
SCHEMBL16405981 0.67
SCHEMBL18092581 0.67
SCHEMBL19171887 0.62
SCHEMBL18991199 0.62
SCHEMBL3836561 0.55 TDP1 (0.36)
SCHEMBL472031 0.53
SCHEMBL37550 0.53
SCHEMBL2020 0.53
SCHEMBL1332279 0.53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 271 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4204219-B1 PARTIAL COATING OF INTRAOCULAR LENSES USING SPATIAL ALD AMO GRONINGEN BV (NL) 2026-05-06 EP claimed
US-20260103796-A1 MULTILAYER COATINGS FOR REDUCED SURFACE METALS ON OXIDE FILMS ENTEGRIS INC (US) 2026-04-16 US claimed
US-12554191-B2 Pellicle membrane and method of forming the same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2026-02-17 US claimed
US-20250320604-A1 LOW TEMPERATURE PLASMA DEPOSITION OF SILICON-CONTAINING FILMS USING HYDROGEN PEROXIDE GELEST INC (US) 2025-10-16 US claimed
US-20250305131-A1 LOW TEMPERATURE THERMAL DEPOSITION OF SILICON-CONTAINING FILMS USING LOW WATER CONTENT HYDROGEN PEROXIDE GELEST, INC. 2025-10-02 US claimed
US-20250266294-A1 METHODS FOR DEPOSITING SILICON OXIDE APPLIED MATERIALS, INC. 2025-08-21 US claimed
US-20250166989-A1 THERMAL FILM DEPOSITION LAM RES CORP (US) 2025-05-22 US claimed
US-20250118568-A1 REDUCED TEMPERATURE ETCHING OF DOPED SILICON OXIDE LAM RESEARCH CORPORATION 2025-04-10 US claimed
US-20250054747-A1 CONFORMAL DEPOSITION OF SILICON NITRIDE LAM RES CORP (US) 2025-02-13 US claimed
CN-119343759-A Cooling etch of doped silicon oxides 朗姆研究公司 2025-01-21 CN claimed
US-20110165346-A1 Precursors for CVD Silicon Carbo-Nitride Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2011-07-07 US claimed
US-20100009546-A1 Aminosilanes for Shallow Trench Isolation Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-01-14 US claimed
EP-2144279-A2 Aminosilanes for shallow trench isolation films Air Products and Chemicals, Inc. (US) 2010-01-13 EP claimed
US-20090130414-A1 Preparation of A Metal-containing Film Via ALD or CVD Processes AIR PRODUCTS AND CHEMICALS, INC. (US) 2009-05-21 US claimed
EP-2058416-A2 Preparation of a metal-containing film via ALD or CVD processes Air Products and Chemicals, Inc. (US) 2009-05-13 EP claimed
EP-1691400-B1 Preparation of metal silicon nitride films via cyclic deposition AIR PROD & CHEM (US) 2009-01-14 EP claimed
EP-2009139-A1 Cyclic Deposition Method for Depositing a Metal Silicon Nitride Film Air Products and Chemicals, Inc. (US) 2008-12-31 EP claimed
US-20080318443-A1 Plasma enhanced cyclic deposition method of metal silicon nitride film AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-12-25 US claimed
US-20060182885-A1 Preparation of metal silicon nitride films via cyclic deposition VERSUM MATERIALS US, LLC 2006-08-17 US claimed
EP-1691400-A1 Preparation of metal silicon nitride films via cyclic deposition Air Products and Chemicals, Inc. (US) 2006-08-16 EP claimed