Known targets — ChEMBL curated mechanism
CHRM1DRD2DRD3DRD4HDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR2APDE3ASIGMAR1
The experimentally established mechanism targets of Lactic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Lactic Acid SCHEMBL8096439 | 1.00 | — | — | |
| Lactic Acid SCHEMBL180386 | 0.96 | TP53 (1.00) | — | |
| D-Lactic Acid SCHEMBL14947 | 0.96 | — | — | |
| Lactic Acid SCHEMBL1412661 | 0.96 | TP53 (1.00) | — | |
| Lactic Acid SCHEMBL9066424 | 0.96 | — | — | |
| Lactic Acid SCHEMBL9066423 | 0.96 | TP53 (1.00) | — | |
| Lactic Acid SCHEMBL5189465 | 0.96 | TP53 (1.00) | — | |
| D-Lactic Acid SCHEMBL4371722 | 0.96 | TP53 (1.00) | — | |
| L-Lactic Acid SCHEMBL16958 | 0.96 | — | — | |
| L-Lactic Acid SCHEMBL13165963 | 0.96 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12540230-B2 | Curable compositions comprising adhesion promoters | HENKEL AG & CO. KGAA (DE) | 2026-02-03 | — | — | US | disclosed |
| EP-4444800-B1 | CURABLE SILICONE COMPOSITIONS CONTAINING ADDITIVES | HENKEL AG & CO KGAA (DE) | 2025-12-24 | — | — | EP | disclosed |
| US-12466921-B2 | Curable silicone compositions containing additives | HENKEL AG & CO. KGAA (DE) | 2025-11-11 | — | — | US | disclosed |
| EP-4332109-B1 | SILANES AND CURABLE COMPOSITIONS CONTAINING THEM | HENKEL AG & CO KGAA (DE) | 2025-08-20 | — | — | EP | disclosed |
| US-20250197570-A1 | SILANES AND CURABLE COMPOSITIONS CONTAINING THEM | HENKEL AG & CO KGAA (DE) | 2025-06-19 | — | — | US | disclosed |
| US-20250136766-A1 | Curable silicone compositions containing additives | HENKEL AG & CO KGAA (DE) | 2025-05-01 | — | — | US | disclosed |
| EP-4444800-A2 | CURABLE SILICONE COMPOSITIONS CONTAINING ADDITIVES | Henkel AG & Co. KGaA (DE) | 2024-10-16 | — | — | EP | disclosed |
| US-12037461-B2 | Encapped curable polyorganosiloxanes | HENKEL AG & CO. KGAA (DE) | 2024-07-16 | — | — | US | disclosed |
| WO-2024046715-A1 | SILANES AND CURABLE COMPOSITIONS CONTAINING THEM | HENKEL AG & CO. KGAA (DE) | 2024-03-07 | — | — | WO | disclosed |
| EP-4332109-A1 | SILANES AND CURABLE COMPOSITIONS CONTAINING THEM | Henkel AG & Co. KGaA (DE) | 2024-03-06 | — | — | EP | disclosed |
| US-11873386-B2 | Curable silicone compositions | HENKEL AG & CO. KGAA (DE) | 2024-01-16 | — | — | US | disclosed |
| US-11753528-B2 | Endcapped curable polyorganosiloxanes | HENKEL AG & CO. KGAA (DE) | 2023-09-12 | — | — | US | disclosed |
| EP-3660116-B1 | ENDCAPPED CURABLE POLYORGANOSILOXANES | HENKEL AG & CO KGAA (DE) | 2023-07-26 | — | — | EP | disclosed |
| WO-2023078724-A2 | CURABLE SILICONE COMPOSITIONS CONTAINING ADDITIVES | HENKEL AG & CO. KGAA (DE) | 2023-05-11 | — | — | WO | disclosed |
| EP-3660117-B1 | CURABLE COMPOSITIONS COMPRISING ADHESION PROMOTERS | HENKEL AG & CO KGAA (DE) | 2023-03-08 | — | — | EP | disclosed |
| US-11364161-B2 | Curable silicone compositions | HENKEL AG & CO. KGAA (DE) | 2022-06-21 | — | — | US | disclosed |
| CN-1692178-A | Method for treating metallic surfaces and products formed thereby | ELISHA HOLDING LLC (US) | 2005-11-02 | — | — | CN | disclosed |
| US-6027554-A | COMPRISING SILICON NITRIDE FINE POWDER AND AT LEAST ONE OF FUMED TITANIA, FUMED ZIRCONIA, FUMED SILICA, WATER AND AN ACID; PLANARIZATION POLISHING A SEMICONDUCTOR; PURITY, REDISPERSIBILITY | FUJIMI INCORPORATED (JP) | 2000-02-22 | — | — | US | disclosed |
| US-5733819-A | SILICON NITRIDE POWDER, WATER AND ACID | FUJIMI INCORPORATED (JP) | 1998-03-31 | — | — | US | disclosed |