SCHEMBL8101682

SCHEMBL8101682

O=C(/C=C/C(=O)OC1CCCCCCC1)OC1CCCCCCC1

nearest known ligand 0.48

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 2/20 0.48
CA12 O43570 2/20 0.43
CA1 P00915 2/20 0.43
CA2 P00918 2/20 0.43
CA9 Q16790 2/20 0.43
CYP2C19 P33261 1/20 0.42
NAAA Q02083 2/20 0.41
HTT P42858 1/20 0.40
CYP19A1 P11511 3/20 0.38
MMP9 P14780 2/20 0.37
MMP12 P39900 2/20 0.37
MMP1 P03956 1/20 0.37
ATM Q13315 1/20 0.36
CES2 O00748 1/20 0.36
CES1 P23141 1/20 0.36
FABP7 O15540 1/20 0.36
FABP5 Q01469 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
MMP2 P08253 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL809678 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL7539573 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL10386171 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL780366 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL10386170 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL17073960 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL8101691 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL7539580 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL22092280 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9
SCHEMBL780364 1.00 EPHX1 (0.48) EPHX1CA12CA1CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8575288-B2 Photocurable resin composition for forming overcoats RGB pixels black matrixes or spacers in color filter production, and color filters DAI NIPPON PRINTING CO., LTD. (JP) 2013-11-05 US disclosed
EP-1006130-A1 Fumaric acid diester resin composition, cross-linked fumaric acid diester resin and process NOF CORPORATION (JP) 2000-06-07 EP disclosed
EP-0534236-B1 Moulding compositions of polymethylmethacrylate with high heat resistance BASF AG (DE) 1995-12-06 EP disclosed
EP-0534236-A2 Moulding compositions of polymethylmethacrylate with high heat resistance BASF Aktiengesellschaft (DE) 1993-03-31 EP disclosed