Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.36 |
| ▸ | CA2 | P00918 | 1/20 | 0.36 |
| ▸ | CA4 | P22748 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | CTDSP1 | Q9GZU7 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | APOBEC3A | P31941 | 1/20 | 0.33 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | SLC18A3 | Q16572 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.30 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.30 |
| ▸ | HSD11B2 | P80365 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6346433 | 0.90 | CA1 (0.42) | CA1CA2CA4ALDH1A1CTDSP1 | |
| SCHEMBL11667053 | 0.88 | CA1 (0.32) | CA1CA2CA4ALDH1A1CTDSP1 | |
| SCHEMBL6355777 | 0.84 | CA1 (0.36) | CA1CA2CA4ALDH1A1TSHR | |
| Vinyl Ether SCHEMBL18784357 | 0.84 | — | — | |
| SCHEMBL13213063 | 0.83 | CA1 (0.39) | CA1CA2CA4ALDH1A1CTDSP1 | |
| SCHEMBL2955039 | 0.83 | CA1 (0.39) | CA1CA2CA4ALDH1A1CTDSP1 | |
| SCHEMBL7180146 | 0.83 | CA1 (0.39) | CA1CA2CA4ALDH1A1CTDSP1 | |
| SCHEMBL1193772 | 0.80 | HSD17B10 (0.35) | — | |
| SCHEMBL14307917 | 0.79 | CA1 (0.36) | CA1CA2CA4ALDH1A1CTDSP1 | |
| SCHEMBL6428213 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220098369-A1 | DEGRADABLE RESIN COMPOSITION, DEGRADABLE CURED PRODUCT AND DOWNHOLE TOOL FOR DRILLING | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-03-31 | — | — | US | claimed |
| EP-3919547-A1 | DEGRADABLE RESIN COMPOSITION, DEGRADABLE CURED PRODUCT AND DOWNHOLE TOOL FOR DRILLING | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-08 | — | — | EP | claimed |
| CN-115361868-A | High-load solution concentrates of dicamba | 巴斯夫公司 | 2022-11-18 | — | — | CN | disclosed |
| CN-115179545-A | Compositions and articles for additive manufacturing and methods of use thereof | 科思创(荷兰)有限公司 | 2022-10-14 | — | — | CN | disclosed |
| CN-115179544-A | Compositions and articles for additive manufacturing and methods of use thereof | 科思创(荷兰)有限公司 | 2022-10-14 | — | — | CN | disclosed |
| US-20220098369-A1 | DEGRADABLE RESIN COMPOSITION, DEGRADABLE CURED PRODUCT AND DOWNHOLE TOOL FOR DRILLING | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-03-31 | — | — | US | disclosed |
| EP-3919547-A1 | DEGRADABLE RESIN COMPOSITION, DEGRADABLE CURED PRODUCT AND DOWNHOLE TOOL FOR DRILLING | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-08 | — | — | EP | disclosed |
| CN-109121431-B | Optical film for organic electroluminescent display device, polarizing film with adhesive layer, and organic electroluminescent display device | 日东电工株式会社 | 2021-07-30 | — | — | CN | disclosed |
| CN-109312046-B | Urethane (meth) acrylate, method for producing urethane (meth) acrylate, curable composition, cured product, and method for producing cured product | 三菱瓦斯化学株式会社 | 2021-04-30 | — | — | CN | disclosed |
| CN-111918935-A | Radiation curable compositions | 湛新比利时股份有限公司 | 2020-11-10 | — | — | CN | disclosed |
| CN-106459368-B | Radiation curable aqueous compositions with controlled polymer flow | 湛新比利时股份有限公司 | 2020-08-25 | — | — | CN | disclosed |
| US-20070122627-A1 | WEATHERABLE, THERMOSTABLE POLYMERS HAVING IMPROVED FLOW COMPOSITION | GENERAL ELECTRIC COMPANY (US) | 2007-05-31 | — | — | US | disclosed |
| US-20070027271-A1 | WEATHERABLE, THERMOSTABLE POLYMERS HAVING IMPROVED FLOW COMPOSITION | GENERAL ELECTRIC COMPANY (US) | 2007-02-01 | — | — | US | disclosed |
| US-7169859-B2 | Weatherable, thermostable polymers having improved flow composition | GENERAL ELECTRIC COMPANY (US) | 2007-01-30 | — | — | US | disclosed |
| US-20050159577-A1 | Weatherable, thermostable polymers having improved flow composition | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2005-07-21 | — | — | US | disclosed |
| JP-2004352653-A | METHOD FOR PRODUCING ALICYCLIC DIEPOXY COMPOUND | NEW JAPAN CHEM CO LTD | 2004-12-16 | — | — | JP | disclosed |
| EP-1445266-A2 | Photoresist copolymer | Daicel Chemical Industries, Ltd. (JP) | 2004-08-11 | — | — | EP | disclosed |
| US-20030180662-A1 | Acid-sensitive compound and resin composition for photoresist | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| EP-1000924-A1 | ACID-SENSITIVE COMPOUND AND RESIN COMPOSITION FOR PHOTORESIST | Daichel Chemical Industries Ltd (JP) | 2000-05-17 | — | — | EP | disclosed |
| US-4255301-A | HEAT RESISTANCE, PHOTOSTABILITY | ARGUS CHEMICAL CORPORATION (US) | 1981-03-10 | — | — | US | disclosed |