⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Sulfide SCHEMBL811998 | 1.00 | — | — | |
| SCHEMBL166503 | 0.97 | CA1 (0.31) | — | |
| Ammonia Solution, Strong SCHEMBL28538685 | 0.94 | — | — | |
| Ammonia Solution, Strong SCHEMBL28932381 | 0.94 | — | — | |
| Iodide SCHEMBL3893255 | 0.94 | — | — | |
| Potassium SCHEMBL3165580 | 0.94 | — | — | |
| Boric Acid SCHEMBL17220526 | 0.94 | — | — | |
| Methane SCHEMBL3208229 | 0.94 | — | — | |
| Iodide SCHEMBL3893250 | 0.94 | — | — | |
| Lithium SCHEMBL30480123 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119752373-A | Thermosetting electrolyte-resistant adhesive, and preparation method and application thereof | 拓迪化学(上海)股份有限公司 | 2025-04-04 | — | — | CN | claimed |
| CN-118222229-A | Anisotropic conductive adhesive and curing method thereof | 深圳先进电子材料国际创新研究院 | 2024-06-21 | — | — | CN | claimed |
| CN-119752373-A | Thermosetting electrolyte-resistant adhesive, and preparation method and application thereof | 拓迪化学(上海)股份有限公司 | 2025-04-04 | — | — | CN | disclosed |
| CN-118222229-A | Anisotropic conductive adhesive and curing method thereof | 深圳先进电子材料国际创新研究院 | 2024-06-21 | — | — | CN | disclosed |
| CN-114736650-B | Low-shrinkage high-weather-resistance UV-thermal dual-curing adhesive and preparation method thereof | 烟台信友新材料有限公司 | 2023-07-14 | — | — | CN | disclosed |
| CN-109313388-B | Negative photosensitive composition | 住友电木株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-102282210-A | Epoxy resin composition | — | 2011-12-14 | — | — | CN | disclosed |
| EP-2387596-A2 | EPOXY RESIN COMPOSITION | 3M Innovative Properties Company (US) | 2011-11-23 | — | — | EP | disclosed |
| US-20110282010-A1 | EPOXY RESIN COMPOSITION | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2011-11-17 | — | — | US | disclosed |
| WO-2010083192-A2 | EPOXY RESIN COMPOSITION | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2010-07-22 | — | — | WO | disclosed |