SCHEMBL81380

SCHEMBL81380

B.O=S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6191 0.87
SCHEMBL8012781 0.87
SCHEMBL2718 0.87
SCHEMBL7105821 0.75
SCHEMBL8775791 0.75
SCHEMBL1299417 0.75
SCHEMBL705803 0.75
SCHEMBL6863659 0.75
Methane SCHEMBL21404648 0.75
SCHEMBL22462299 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 456 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12422750-B2 Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
CN-116648313-B Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2025-05-16 CN disclosed
CN-119937247-A Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2025-05-06 CN disclosed
CN-115190891-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-10-15 CN disclosed
CN-114981360-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-09-10 CN disclosed
CN-115667404-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-05-03 CN disclosed
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 US disclosed
CN-116234845-A Method for producing cured product, method for producing laminate, and method for producing semiconductor device 富士胶片株式会社 2023-06-06 CN disclosed
WO-2022265030-A1 METHOD FOR MANUFACTURING PERMANENT FILM, METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING DEVICE, AND PERMANENT FILM 富士フイルム株式会社 2022-12-22 WO disclosed
WO-2022244717-A1 COMPOSITION FOR FORMING POLYIMIDE-CONTAINING PART, JOINED BODY MANUFACTURING METHOD, JOINED BODY, DEVICE MANUFACTURING METHOD AND DEVICE 富士フイルム株式会社 2022-11-24 WO disclosed
EP-1552923-A2 Lithographic printing plate precursor and lithographic printing method using the same FUJI PHOTO FILM CO., LTD. (JP) 2005-07-13 EP disclosed
CN-1637599-A Lithographic printing plate precursor and lithographic printing method using the same FUJI PHOTO FILM CO LTD (JP) 2005-07-13 CN disclosed
US-20050069811-A1 Actinic radiation absorber, polymerization initiator and a polymerzation monomer to form polymer layer that will carry ink that can be removed and forming images with exposure to laser beams FUJIFILM CORPORATION (JP) 2005-03-31 US disclosed
EP-1518672-A2 Lithographic printing plate precursor and lithographic printing method FUJI PHOTO FILM CO., LTD. (JP) 2005-03-30 EP disclosed
US-6866981-B2 Mixture of cationic polymer containing unsaturated aromatic compound and sulfonated aromatic compound, photoinitiator and acid generator MITSUBISHI PAPER MILLS LIMITED (JP) 2005-03-15 US disclosed
US-20040188887-A1 Process of producing three-dimensionally shaped object FUJI PHOTO FILM CO., LTD. 2004-09-30 US disclosed
US-6794104-B2 FINE PARTICULATE HYDROPHOBICIZING PRECURSOR AND HYDROPHILIC METALLIZED BINDER POLYMER; IMAGE FORMING LAYER COMPRISING LIGHT-HEAT CONVERTING SUBSTANCE AND MICROCAPSULE ENCAPSULATING HYDROPHOBIC SUBSTANCE FUJI PHOTO FILM CO., LTD. (JP) 2004-09-21 US disclosed
US-20030190548-A1 Mixture of cationic polymer containing unsaturated aromatic compound and sulfonated aromatic compound, photoinitiator and acid generator MITSUBISHI PAPER MILLS LIMITED (JP) 2003-10-09 US disclosed
US-20030164105-A1 FINE PARTICULATE HYDROPHOBICIZING PRECURSOR AND HYDROPHILIC METALLIZED BINDER POLYMER; IMAGE FORMING LAYER COMPRISING LIGHT-HEAT CONVERTING SUBSTANCE AND MICROCAPSULE ENCAPSULATING HYDROPHOBIC SUBSTANCE FUJI PHOTO FILM CO., LTD. 2003-09-04 US disclosed
EP-1338435-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2003-08-27 EP disclosed