⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10493887 | 0.87 | — | — | |
| SCHEMBL30468735 | 0.82 | — | — | |
| SCHEMBL23453 | 0.82 | — | — | |
| SCHEMBL27633229 | 0.82 | — | — | |
| SCHEMBL11969923 | 0.82 | — | — | |
| SCHEMBL28871709 | 0.82 | — | — | |
| SCHEMBL716266 | 0.82 | — | — | |
| SCHEMBL17939893 | 0.82 | — | — | |
| SCHEMBL184680 | 0.82 | — | — | |
| SCHEMBL28286027 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6144006-A | DISSOLVING COPPER AND TUNGSTEN OR VANADIUM TO FORM AN ALLOY THAT INCREASES THE LIQUIDUS OF ALUMINUM WHEN DISSOLVED IN MOLTEN ALUMINUM, DEVOID OF AN EUDTECTIC, COOLING THE ALLOY, SHAPING TO FORM ELECTRODE, PASSING CURRENT FOR SPOT WELDING | FORD GLOBAL TECHNOLOGIES, INC. (US) | 2000-11-07 | — | — | US | disclosed |
| US-4288259-A | Tantalum modified gamma prime-alpha eutectic alloy | UNITED TECHNOLOGIES CORPORATION (US) | 1981-09-08 | — | — | US | disclosed |