SCHEMBL822719

SCHEMBL822719

CO[C@H]1CO[C@H]2[C@@H]1OC[C@H]2OC(C)=O

nearest known ligand 0.49

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
BCHE P06276 11/20 0.49
ALDH1A1 P00352 1/20 0.39
MAPT P10636 1/20 0.37
PDE1C Q14123 1/20 0.36
CHRM2 P08172 2/20 0.35
MEN1 O00255 1/20 0.35
CYP2D6 P10635 1/20 0.35
KMT2A Q03164 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26205730 1.00 BCHE (0.49) BCHEALDH1A1MAPTPDE1CCHRM2
SCHEMBL822521 1.00 BCHE (0.49) BCHEALDH1A1MAPTPDE1CCHRM2
SCHEMBL822750 1.00 BCHE (0.49) BCHEALDH1A1MAPTPDE1CCHRM2
SCHEMBL16261717 1.00 BCHE (0.49) BCHEALDH1A1MAPTPDE1CCHRM2
SCHEMBL8224976 1.00 BCHE (0.49) BCHEALDH1A1MAPTPDE1CCHRM2
SCHEMBL822629 1.00 BCHE (0.49) BCHEALDH1A1MAPTPDE1CCHRM2
SCHEMBL12199932 0.92 BCHE (0.54) BCHEALDH1A1MAPTCHRM2MEN1
SCHEMBL7150802 0.92 BCHE (0.54) BCHEALDH1A1MAPTCHRM2MEN1
SCHEMBL7152562 0.92 BCHE (0.54) BCHEALDH1A1MAPTCHRM2MEN1
SCHEMBL7276665 0.92 BCHE (0.54) BCHEALDH1A1MAPTCHRM2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10035336-B2 Multilayer body TEIJIN LIMITED (JP) 2018-07-31 US disclosed
US-20180022880-A1 FILM TEIJIN LIMITED (JP) 2018-01-25 US disclosed
US-20170203556-A1 MULTILAYER BODY TEIJIN LIMITED (JP) 2017-07-20 US disclosed
US-20170037220-A1 POLYCARBONATE RESIN COMPOSITION TEIJIN LIMITED (JP) 2017-02-09 US disclosed
US-20160075823-A1 POLYCARBONATE MOLDED ARTICLE TEIJIN LIMITED (JP) 2016-03-17 US disclosed
US-9018340-B2 Copolycarbonate and transparent molded article obtained therefrom TEIJIN LIMITED (JP) 2015-04-28 US disclosed
US-9018340-B2 Copolycarbonate and transparent molded article obtained therefrom TEIJIN LIMITED (JP) 2015-04-28 US disclosed
US-9018338-B2 Polycarbonate resin and molded article thereof TEIJIN LIMITED (JP) 2015-04-28 US disclosed
US-9018338-B2 Polycarbonate resin and molded article thereof TEIJIN LIMITED (JP) 2015-04-28 US disclosed
US-20150087804-A1 COPOLYCARBONATE TEIJIN LIMITED (JP) 2015-03-26 US disclosed
US-20140128567-A1 COPOLYCARBONATE AND TRANSPARENT MOLDED ARTICLE OBTAINED THEREFROM TEIJIN LIMITED (JP) 2014-05-08 US disclosed
US-20140128567-A1 COPOLYCARBONATE AND TRANSPARENT MOLDED ARTICLE OBTAINED THEREFROM TEIJIN LIMITED (JP) 2014-05-08 US disclosed
US-20130253162-A1 POLYCARBONATE RESIN AND MOLDED ARTICLE THEREOF TEIJIN LIMITED (JP) 2013-09-26 US disclosed
US-20130253162-A1 POLYCARBONATE RESIN AND MOLDED ARTICLE THEREOF TEIJIN LIMITED (JP) 2013-09-26 US disclosed
US-8455611-B2 Optical film TEIJIN CHEMICALS LTD. (JP) 2013-06-04 US disclosed
US-8455611-B2 Optical film TEIJIN CHEMICALS LTD. (JP) 2013-06-04 US disclosed
US-20130005939-A1 OPTICAL FILM MOTOYOSHI TETSUYA (JP) 2013-01-03 US disclosed
US-8293861-B2 Optical film TEIJIN CHEMICALS LTD. (JP) 2012-10-23 US disclosed
US-20120228782-A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE Sumitomo Bakelite Co, Ltd (JP) 2012-09-13 US disclosed
US-20110288261-A1 OPTICAL FILM TEIJIN CHEMICALS LTD. (JP) 2011-11-24 US disclosed