SCHEMBL826191

SCHEMBL826191

O=COC1=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4585601 0.82
SCHEMBL262148 0.77
SCHEMBL261204 0.71
SCHEMBL262249 0.69
SCHEMBL518452 0.68 HDAC4 (0.31)
SCHEMBL1695541 0.68 HDAC4 (0.31)
SCHEMBL1695535 0.68 HDAC4 (0.31)
SCHEMBL11045053 0.68
SCHEMBL1628263 0.68 HDAC4 (0.31)
SCHEMBL18293367 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 140 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2016119848-A1 METHOD FOR THE PREPARATION OF CYCLOALIPHATIC EPOXY RESINS HENKEL AG & CO. KGAA (DE) 2016-08-04 WO claimed
US-20240174809-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2024-05-30 US disclosed
WO-2024079924-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 日本化薬株式会社 2024-04-18 WO disclosed
WO-2024079923-A1 RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ELEMENT, AND DRY FILM RESIST 日本化薬株式会社 2024-04-18 WO disclosed
CN-114787276-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-03-21 CN disclosed
CN-115032863-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2022-09-09 CN disclosed
CN-113242996-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2022-07-12 CN disclosed
US-11174272-B2 1-arylcarbonyl-4-oxy-piperidine compounds useful for the treatment of neurodegenerative diseases TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2021-11-16 US disclosed
CN-113242996-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2021-08-10 CN disclosed
CN-107428700-B 9-membered fused ring derivative 盐野义制药株式会社 2021-08-03 CN disclosed
WO-2009136663-A1 FUSED HETEROCYCLIC DERIVATIVES AND USE THEREOF TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2009-11-12 WO disclosed
US-20090270359-A1 SUBSTITUTED PYRAZOLE DERIVATIVES TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2009-10-29 US disclosed
US-20090270361-A1 Substituted pyrazole derivatives and use thereof TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2009-10-29 US disclosed
WO-2009119880-A1 SUBSTITUTED PYRAZOLE DERIVATIVES AND USE THEREOF TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2009-10-01 WO disclosed
US-20090163488-A1 FUSED HETEROCYCLE DERIVATIVES AND USE THEREOF TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2009-06-25 US disclosed
US-20090137595-A1 FUSED HETEROCYCLIC DERIVATIVE AND USE THEREOF TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2009-05-28 US disclosed
EP-2049541-A2 FUSED HETEROCYCLIC DERIVATIVE AND USE THEREOF Takeda Pharmaceutical Company Limited (JP) 2009-04-22 EP disclosed
US-20090023916-A1 TETRAZINE-BASED BIO-ORTHOGONAL COUPLING REAGENTS AND METHODS UNIVERSITY OF DELAWARE (US) 2009-01-22 US disclosed
WO-2008150015-A1 HETEROBICYCLIC COMPOUNDS AS KINASE INHIBITORS TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2008-12-11 WO disclosed
WO-2008016192-A2 FUSED HETEROCYCLIC DERIVATIVE AND USE THEREOF TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2008-02-07 WO disclosed