SCHEMBL82860

SCHEMBL82860

C=C[SiH2]OCC(c1ccccc1)c1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 2/20 0.39
CA1 P00915 2/20 0.39
CA2 P00918 2/20 0.39
CA9 Q16790 2/20 0.39
HTR2A P28223 6/20 0.37
TAAR1 Q96RJ0 1/20 0.37
CYP2C19 P33261 1/20 0.35
ALDH1A1 P00352 2/20 0.34
TSHR P16473 1/20 0.34
HRH1 P35367 5/20 0.34
CA7 P43166 1/20 0.34
SCN4A P35499 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
TDP1 Q9NUW8 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP2D6 P10635 1/20 0.32
PKM P14618 1/20 0.32
NPSR1 Q6W5P4 1/20 0.32
CHRNB2 P17787 1/20 0.31
CHRNA4 P43681 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28661133 0.77 CA12 (0.37) CA12CA1CA2CA9HTR2A
SCHEMBL28883496 0.77 CA12 (0.37) CA12CA1CA2CA9HTR2A
SCHEMBL4169446 0.72 CA12 (0.42) CA12CA1CA2CA9HTR2A
SCHEMBL2238107 0.72 CA12 (0.42) CA12CA1CA2CA9HTR2A
SCHEMBL705912 0.72 CA12 (0.42) CA12CA1CA2CA9HTR2A
SCHEMBL704842 0.72 CA12 (0.42) CA12CA1CA2CA9HTR2A
SCHEMBL3894510 0.72 HTR2A (0.46) CA12CA1CA2CA9HTR2A
SCHEMBL8644599 0.72 CA12 (0.43) CA12CA1CA2CA9HTR2A
SCHEMBL2449398 0.71 TSHR (0.37) HTR2ACYP2C19ALDH1A1TSHRHRH1
SCHEMBL703382 0.71 CA12 (0.41) CA12CA1CA2CA9HTR2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 268 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12331164-B2 Curable siloxane resin composition KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2025-06-17 US claimed
CN-115181223-B Low-gloss matte auxiliary agent, preparation method thereof and molded body 铨盛聚碳科技股份有限公司 2023-08-29 CN claimed
WO-2023072128-A1 COLORANT COMPOSITION AND COATED ARTICLE GUANGDONG HUARUN PAINTS CO., LTD. (CN) 2023-05-04 WO claimed
US-20230078587-A1 CURABLE SILOXANE RESIN COMPOSITION KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2023-03-16 US claimed
CN-113956727-A Colorant composition and coated article 广东华润涂料有限公司 2022-01-21 CN claimed
CN-110734552-B Preparation method of high-purity silicon carbide polycrystalline powder source precursor 哈尔滨工业大学 2021-12-14 CN claimed
CN-110734552-A Preparation method of high-purity silicon carbide polycrystalline powder source precursors 哈尔滨工业大学 2020-01-31 CN claimed
EP-2791241-B1 POLYHYDROXY CURABLE FLUOROELASTOMER COMPOSITIONS CHEMOURS CO FC LLC (US) 2018-11-28 EP claimed
EP-2791241-A1 POLYHYDROXY CURABLE FLUOROELASTOMER COMPOSITIONS E. I. Du Pont de Nemours and Company (US) 2014-10-22 EP claimed
EP-2470574-B1 PROCESS AND CATALYST SYSTEM FOR POLYDIENE PRODUCTION BRIDGESTONE CORP (JP) 2014-09-17 EP claimed
US-20070077782-A1 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
WO-2006091264-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2006-08-31 WO claimed
EP-1390972-B1 METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY IBM (US) 2006-07-12 EP claimed
US-20050215072-A1 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2005-09-29 US claimed
US-6710450-B2 Interconnect structure with precise conductor resistance and method to form same INTERNATIONAL BUSINESS MACHINES CORPORATION 2004-03-23 US claimed
EP-1390972-A2 METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY International Business Machines Corporation (US) 2004-02-25 EP claimed
US-20020160600-A1 Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2002-10-31 US claimed
US-6455443-B1 APPLYING UNIFORM COATING OF SILANE COUPLING AGENT CONTAINING POLYMERIZABLE GROUP TO SURFACE OF SUBSTRATE, HEATING TO PROVIDE MODIFIED SURFACE LAYER CONTAINING SI-O BONDS, RINSING WITH SOLVENT TO REMOVE UNREACTED COUPLER, APPLYING DIELECTRIC INTERNATIONAL BUSINESS MACHINES CORPORATION 2002-09-24 US claimed
WO-2002069381-A2 METHOD OF FABRICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2002-09-06 WO claimed
US-20020117737-A1 Interconnect structure with precise conductor resistance and method to form same INTERNATIONAL BUSINESS CORPORATION (US) 2002-08-29 US claimed