⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28796436 | 0.89 | — | — | |
| SCHEMBL29124169 | 0.89 | — | — | |
| SCHEMBL27501706 | 0.87 | — | — | |
| SCHEMBL544863 | 0.87 | — | — | |
| SCHEMBL33328 | 0.87 | — | — | |
| SCHEMBL27876529 | 0.87 | — | — | |
| SCHEMBL27680381 | 0.87 | — | — | |
| SCHEMBL6003971 | 0.87 | — | — | |
| SCHEMBL23356144 | 0.75 | — | — | |
| SCHEMBL1509748 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7359178-B2 | Electrical functional unit | EPCOS AG (DE) | 2008-04-15 | — | — | US | claimed |
| US-20060120016-A1 | Electrical functional unit | EPCOS AG (DE) | 2006-06-08 | — | — | US | claimed |
| US-8754524-B2 | Wafer-level interconnect for high mechanical reliability applications | FLIPCHIP INTERNATIONAL, LLC (US) | 2014-06-17 | — | — | US | disclosed |
| US-20120146219-A1 | WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS | FLIPCHIP INTERNATIONAL, LLC (US) | 2012-06-14 | — | — | US | disclosed |
| US-8143722-B2 | Wafer-level interconnect for high mechanical reliability applications | FLIPCHIP INTERNATIONAL, LLC (US) | 2012-03-27 | — | — | US | disclosed |
| EP-2070109-A2 | WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS | FlipChip International L.L.C. (US) | 2009-06-17 | — | — | EP | disclosed |
| WO-2008118193-A2 | WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS | FLIPCHIP INTERNATIONAL, LLC (US) | 2008-10-02 | — | — | WO | disclosed |
| US-20080083986-A1 | WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS | HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD. (CN) | 2008-04-10 | — | — | US | disclosed |