⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL693062 | 0.75 | — | — | |
| SCHEMBL11600202 | 0.75 | — | — | |
| SCHEMBL8090379 | 0.75 | — | — | |
| SCHEMBL20163782 | 0.73 | — | — | |
| SCHEMBL23446397 | 0.71 | — | — | |
| SCHEMBL8823186 | 0.71 | — | — | |
| SCHEMBL24441249 | 0.71 | — | — | |
| SCHEMBL20833282 | 0.71 | — | — | |
| SCHEMBL23073834 | 0.71 | — | — | |
| SCHEMBL3208617 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5998297-A | SUBJECTING THE CONDUCTIVE STRUCTURE TO A COMBINATION OF PLASMA, AN ETCHANT, AND A GASEOUS ALUMINUM SOURCE. | TEXAS INSTRUMENTS INCORPORATED (US) | 1999-12-07 | — | — | US | claimed |
| EP-0838848-A1 | Plasma etching of a metal layer comprising copper | TEXAS INSTRUMENTS INCORPORATED (US) | 1998-04-29 | — | — | EP | claimed |
| CN-101511796-B | Imidazole derivatives | KYOWA HAKKO KOGYO KK | 2012-05-09 | — | — | CN | disclosed |
| US-5998297-A | SUBJECTING THE CONDUCTIVE STRUCTURE TO A COMBINATION OF PLASMA, AN ETCHANT, AND A GASEOUS ALUMINUM SOURCE. | TEXAS INSTRUMENTS INCORPORATED (US) | 1999-12-07 | — | — | US | disclosed |
| US-5998297-A | SUBJECTING THE CONDUCTIVE STRUCTURE TO A COMBINATION OF PLASMA, AN ETCHANT, AND A GASEOUS ALUMINUM SOURCE. | TEXAS INSTRUMENTS INCORPORATED (US) | 1999-12-07 | — | — | US | disclosed |
| EP-0838848-A1 | Plasma etching of a metal layer comprising copper | TEXAS INSTRUMENTS INCORPORATED (US) | 1998-04-29 | — | — | EP | disclosed |
| EP-0838848-A1 | Plasma etching of a metal layer comprising copper | TEXAS INSTRUMENTS INCORPORATED (US) | 1998-04-29 | — | — | EP | disclosed |