SCHEMBL83365

SCHEMBL83365

[CH2]C/C=C/CC[CH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL83366 1.00
SCHEMBL944499 0.88
SCHEMBL5984389 0.88
SCHEMBL11474234 0.84
SCHEMBL8648395 0.84
SCHEMBL1541565 0.79
SCHEMBL1541564 0.79
SCHEMBL1541653 0.79
SCHEMBL525965 0.79
SCHEMBL43592 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210323217-A1 METHOD OF MANUFACTURING A HEAT-SHRINK ELASTOMERIC ELEMENT HALLIBURTON ENERGY SERVICES, INC. 2021-10-21 US disclosed
US-11065807-B2 Method of manufacturing a heat-shrink elastomeric element THE UNIVERSITY OF TEXAS SYSTEM BOARD OF REGENTS (US) 2021-07-20 US disclosed
WO-2021078223-A1 BIOCHEMICAL COMPOUND BLOCKING REMOVER, PREPARATION METHOD THEREFOR AND USE THEREOF 中国石油化工股份有限公司 2021-04-29 WO disclosed
US-10752816-B2 Reaction-curable adhesive, adhesive kit, and method of using reaction-curable adhesive NITTO SHINKO CORPORATION (JP) 2020-08-25 US disclosed
EP-3354673-B1 REACTION-CURABLE ADHESIVE, ADHESIVE KIT, AND METHOD OF USING REACTION-CURABLE ADHESIVE NITTO SHINKO CORP (JP) 2020-08-05 EP disclosed
US-20190077070-A1 HEAT-SHRINK ELASTOMERIC ELEMENTS MADE FROM SHAPE MEMORY POLYMERS HALLIBURTON ENERGY SERVICES, INC. 2019-03-14 US disclosed
EP-3354673-A1 REACTION-CURABLE ADHESIVE, ADHESIVE KIT, AND METHOD OF USING REACTION-CURABLE ADHESIVE Nitto Shinko Corporation (JP) 2018-08-01 EP disclosed
US-20180208810-A1 REACTION-CURABLE ADHESIVE, ADHESIVE KIT, AND METHOD OF USING REACTION-CURABLE ADHESIVE NITTO SHINKO CORPORATION (JP) 2018-07-26 US disclosed
EP-2751308-B1 PROCESS FOR CATHODIC DEOXYGENATION OF AMIDES AND ESTERS Johannes Gutenberg-Universität Mainz (DE) 2017-03-22 EP disclosed
EP-3048098-A1 N-ACYLSULFONAMIDE APOPTOSIS PROMOTERS AbbVie Bahamas Limited (BS) 2016-07-27 EP disclosed
US-20070072833-A1 Survivin inhibitors ABBVIE INC. 2007-03-29 US disclosed
US-20070015787-A1 Apoptosis promoters ABBVIE INC. 2007-01-18 US disclosed
US-20060258657-A1 Apoptosis promoters ABBVIE INC. 2006-11-16 US disclosed
US-20060199800-A1 Pyrimidine compounds and pests controlling composition containing the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2006-09-07 US disclosed
US-20060128706-A1 Apoptosis promoters ABBVIE INC. 2006-06-15 US disclosed
US-7018993-B2 Antiandrogenic agent CHUGAI SEIYAKU KABUSHIKI KAISHA (JP) 2006-03-28 US disclosed
US-20050159427-A1 N-acylsulfonamide apoptosis promoters ABBOTT LABORATORIES 2005-07-21 US disclosed
US-20030158164-A1 Novel antiandrogenic agent CHUGAI SEIYAKU KABUSHIKI KAISHA (JP) 2003-08-21 US disclosed
EP-1304334-A1 NOVEL ANTIANDROGENIC AGENT CHUGAI SEIYAKU KABUSHIKI KAISHA (JP) 2003-04-23 EP disclosed
EP-1219631-A1 ANTIANDROGEN AGENTS CHUGAI SEIYAKU KABUSHIKI KAISHA (JP) 2002-07-03 EP disclosed