SCHEMBL8370804

SCHEMBL8370804

C=C[Si](C=C)(OCC)OCC.C=C[Si](Cl)(Cl)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL121771 0.87
SCHEMBL10799204 0.85
SCHEMBL17498999 0.80
SCHEMBL10622828 0.78
SCHEMBL22654215 0.76
SCHEMBL28080201 0.74
SCHEMBL7624670 0.73
SCHEMBL28501782 0.72
SCHEMBL388015 0.72
SCHEMBL388224 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0735163-B1 Electroconductive conjugate fiber TEIJIN LTD (JP) 1999-01-27 EP disclosed
US-5654096-A MULTICOMPONENT FILAMENTS COMPRISING METALLIC INORGANIC CORE PARTICLES DISPERSING IN A THERMOPLASTIC RESIN, THE CORE SURFACE TREATED SILANE COMPOUND TEIJIN LIMITED (JP) 1997-08-05 US disclosed
EP-0735163-A1 Electroconductive conjugate fiber TEIJIN LIMITED (JP) 1996-10-02 EP disclosed