⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Dimethylamine SCHEMBL7798138 | 0.84 | KDM4E (0.38) | — | |
| Dimethylamine SCHEMBL2597851 | 0.84 | — | — | |
| Dimethylamine SCHEMBL2462737 | 0.77 | — | — | |
| Dimethylamine SCHEMBL28232865 | 0.77 | — | — | |
| Dimethylamine SCHEMBL30533218 | 0.77 | — | — | |
| SCHEMBL1195888 | 0.77 | — | — | |
| Dimethylamine SCHEMBL1030 | 0.76 | — | — | |
| Dimethylamine SCHEMBL12415750 | 0.76 | — | — | |
| Dimethylamine SCHEMBL392668 | 0.76 | — | — | |
| Dimethylamine SCHEMBL13695986 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4368223-A | REDUCTION OF NICKEL COMPOUND FROM SOLUTION CONTAINING DIETHYLENETRIAMINE OR IMIDAZOLE | ASAHI GLASS COMPANY, LTD. (JP) | 1983-01-11 | — | — | US | claimed |
| EP-0692554-B1 | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 1999-01-20 | — | — | EP | disclosed |
| US-5795828-A | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1998-08-18 | — | — | US | disclosed |
| US-5645628-A | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1997-07-08 | — | — | US | disclosed |
| EP-0692554-A1 | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1996-01-17 | — | — | EP | disclosed |
| EP-0350078-B1 | Optical information carrier and optical cards | DAINIPPON PRINTING CO LTD (JP) | 1994-03-09 | — | — | EP | disclosed |
| US-5041356-A | Optical card; high density recording | DAI NIPPON INSATSU KABUSHIKI KAISHA (JP) | 1991-08-20 | — | — | US | disclosed |
| EP-0158906-B1 | OPTICAL CARD | DAI NIPPON INSATSU KABUSHIKI KAISHA (JP) | 1991-02-20 | — | — | EP | disclosed |
| US-4816362-A | MULTILAYER, LIGHT SENSITIVE ELEMENT | DAI NIPPON INSATSU KABUSHIKI KAISHA (JP) | 1989-03-28 | — | — | US | disclosed |
| US-4673626-A | Optical recording card with optical recording layers | DAI NIPPON INSATSU KABUSHIKI KAISHA (JP) | 1987-06-16 | — | — | US | disclosed |
| EP-0066656-B1 | PROCESS FOR PREPARING NICKEL LAYER | ASAHI GLASS COMPANY LTD. (JP) | 1985-09-25 | — | — | EP | disclosed |
| US-4368223-A | REDUCTION OF NICKEL COMPOUND FROM SOLUTION CONTAINING DIETHYLENETRIAMINE OR IMIDAZOLE | ASAHI GLASS COMPANY, LTD. (JP) | 1983-01-11 | — | — | US | disclosed |
| EP-0066656-A1 | Process for preparing nickel layer | ASAHI GLASS COMPANY LTD. (JP) | 1982-12-15 | — | — | EP | disclosed |