⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Trimethylammonium SCHEMBL8371792 | 0.71 | — | — | |
| Trimethylammonium SCHEMBL27663224 | 0.60 | — | — | |
| SCHEMBL170103 | 0.59 | — | — | |
| SCHEMBL1796257 | 0.59 | — | — | |
| SCHEMBL15241371 | 0.59 | — | — | |
| SCHEMBL10041774 | 0.56 | — | — | |
| Hydrochloric Acid SCHEMBL2253702 | 0.56 | — | — | |
| SCHEMBL3794951 | 0.56 | — | — | |
| Water SCHEMBL15334116 | 0.56 | — | — | |
| SCHEMBL13709649 | 0.56 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4368223-A | REDUCTION OF NICKEL COMPOUND FROM SOLUTION CONTAINING DIETHYLENETRIAMINE OR IMIDAZOLE | ASAHI GLASS COMPANY, LTD. (JP) | 1983-01-11 | — | — | US | claimed |
| WO-2023211934-A1 | LIPIDS, FORMULATIONS, AND USES THEREOF | THE REGENTS OF THE UNIVERSITY OF MICHIGAN (US) | 2023-11-02 | — | — | WO | disclosed |
| EP-0692554-B1 | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 1999-01-20 | — | — | EP | disclosed |
| US-5795828-A | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1998-08-18 | — | — | US | disclosed |
| US-5645628-A | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1997-07-08 | — | — | US | disclosed |
| EP-0692554-A1 | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1996-01-17 | — | — | EP | disclosed |
| EP-0066656-B1 | PROCESS FOR PREPARING NICKEL LAYER | ASAHI GLASS COMPANY LTD. (JP) | 1985-09-25 | — | — | EP | disclosed |
| US-4368223-A | REDUCTION OF NICKEL COMPOUND FROM SOLUTION CONTAINING DIETHYLENETRIAMINE OR IMIDAZOLE | ASAHI GLASS COMPANY, LTD. (JP) | 1983-01-11 | — | — | US | disclosed |
| EP-0066656-A1 | Process for preparing nickel layer | ASAHI GLASS COMPANY LTD. (JP) | 1982-12-15 | — | — | EP | disclosed |