⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2456317 | 0.76 | — | — | |
| SCHEMBL5569190 | 0.76 | — | — | |
| SCHEMBL27996406 | 0.72 | — | — | |
| SCHEMBL28174561 | 0.72 | — | — | |
| Methane SCHEMBL3446774 | 0.71 | — | — | |
| SCHEMBL27531037 | 0.71 | — | — | |
| SCHEMBL1420702 | 0.71 | — | — | |
| SCHEMBL6025651 | 0.71 | — | — | |
| Ammonia Solution, Strong SCHEMBL27609188 | 0.70 | — | — | |
| SCHEMBL25210583 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115851218-A | Low-specific-gravity high-heat-conductivity flame-retardant adhesive and preparation method thereof | 吴江雨曲电子材料有限公司 | 2023-03-28 | — | — | CN | claimed |
| CN-115386293-A | Sprayable silicone adhesive for power equipment and preparation method thereof | 杭州赛维动力科技有限公司 | 2022-11-25 | — | — | CN | claimed |
| CN-115093826-A | High-thermal-conductivity low-specific-gravity adhesive and preparation method thereof | 深圳市希顺有机硅科技有限公司 | 2022-09-23 | — | — | CN | claimed |
| CN-113659120-A | Elastic aerogel derived high-capacity silicon-oxygen-carbon lithium battery negative electrode material and preparation method thereof | 江苏泛亚微透科技股份有限公司 | 2021-11-16 | — | — | CN | claimed |
| CN-111153657-A | Building energy-saving foaming insulation board and preparation method thereof | 济南鸿运保温材料有限公司 | 2020-05-15 | — | — | CN | claimed |
| CN-120248763-B | Lignin nano bottle-based photo-thermal super-hydrophobic deicing coating composition, coating, preparation method and application | 齐鲁工业大学(山东省科学院) | 2026-04-10 | — | — | CN | disclosed |
| CN-120248763-A | Lignin nano bottle-based photo-thermal super-hydrophobic deicing coating composition, coating, preparation method and application | 齐鲁工业大学(山东省科学院) | 2025-07-04 | — | — | CN | disclosed |
| CN-115851218-A | Low-specific-gravity high-heat-conductivity flame-retardant adhesive and preparation method thereof | 吴江雨曲电子材料有限公司 | 2023-03-28 | — | — | CN | disclosed |
| CN-115386293-A | Sprayable silicone adhesive for power equipment and preparation method thereof | 杭州赛维动力科技有限公司 | 2022-11-25 | — | — | CN | disclosed |
| CN-115386293-A | Sprayable silicone adhesive for power equipment and preparation method thereof | 杭州赛维动力科技有限公司 | 2022-11-25 | — | — | CN | disclosed |
| CN-115093826-A | High-thermal-conductivity low-specific-gravity adhesive and preparation method thereof | 深圳市希顺有机硅科技有限公司 | 2022-09-23 | — | — | CN | disclosed |
| CN-115093826-A | High-thermal-conductivity low-specific-gravity adhesive and preparation method thereof | 深圳市希顺有机硅科技有限公司 | 2022-09-23 | — | — | CN | disclosed |
| CN-113278249-A | Epoxy resin composition and preparation method thereof | 衡所华威电子有限公司 | 2021-08-20 | — | — | CN | disclosed |
| CN-112063359-A | Adhesive composition and bonding method | 广东美的厨房电器制造有限公司 | 2020-12-11 | — | — | CN | disclosed |
| CN-107266972-B | Thermosetting type hollow coated glass protection ink and preparation method thereof | 广州亦盛环保科技有限公司 | 2020-10-27 | — | — | CN | disclosed |
| CN-111153657-A | Building energy-saving foaming insulation board and preparation method thereof | 济南鸿运保温材料有限公司 | 2020-05-15 | — | — | CN | disclosed |
| CN-111153657-A | Building energy-saving foaming insulation board and preparation method thereof | 济南鸿运保温材料有限公司 | 2020-05-15 | — | — | CN | disclosed |
| US-8828886-B2 | Low dielectric constant insulating film and method for forming the same | TOHOKU UNIVERSITY (JP) | 2014-09-09 | — | — | US | disclosed |
| US-20120190212-A1 | LOW DIELECTRIC CONSTANT INSULATING FILM AND METHOD FOR FORMING THE SAME | TOHOKU UNIVERSITY (JP) | 2012-07-26 | — | — | US | disclosed |
| US-6001948-A | BASED ON HYDROXY-TERMINATED POLYDIORGANOSILOXANES CONTAINING A TRIALKOXYSILANE WITH A SUBSTITUTED AMIDOALKYL RADICAL, WHICH CAN BE PREPARED USING CONVENTIONAL MIXING TECHNOLOGIES. | WACKER-CHEMIE GMBH (DE) | 1999-12-14 | — | — | US | disclosed |