SCHEMBL838140

SCHEMBL838140

O=c1[nH]c(=O)n(CCO)c(=O)n1CCO

nearest known ligand 0.59

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
APEX1 P27695 1/20 0.59
PDE4A P27815 1/20 0.38
PDE4B Q07343 1/20 0.38
PDE4C Q08493 1/20 0.38
PDE4D Q08499 1/20 0.38
HPGD P15428 2/20 0.37
ALDH1A1 P00352 2/20 0.37
KMT2A Q03164 1/20 0.37
PKM P14618 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
ADORA3 P0DMS8 1/20 0.33
CYP3A4 P08684 1/20 0.33
HSD17B10 Q99714 1/20 0.33
UNG P13051 2/20 0.33
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL830282 0.86 CYP3A4 (0.54) APEX1PDE4APDE4BPDE4CPDE4D
SCHEMBL10975481 0.86 APEX1 (0.55) APEX1PDE4APDE4BPDE4CPDE4D
Methacrylic Acid SCHEMBL2971459 0.83 APEX1 (0.53) APEX1PDE4APDE4BPDE4CPDE4D
Methacrylic Acid SCHEMBL2135482 0.83 APEX1 (0.53) APEX1PDE4APDE4BPDE4CPDE4D
SCHEMBL35878 0.81 PDE4A (0.39) APEX1PDE4APDE4BPDE4CPDE4D
SCHEMBL289967 0.80 APEX1 (0.39) APEX1PDE4APDE4BPDE4CPDE4D
SCHEMBL5197165 0.79 APEX1 (0.52) APEX1HPGDALDH1A1CYP3A4
SCHEMBL29251515 0.79 APEX1 (0.48) APEX1PDE4APDE4BPDE4CPDE4D
SCHEMBL3631526 0.76 APEX1 (0.46) APEX1HPGDPKMSMN1; SMN2
SCHEMBL8022374 0.76 APEX1 (0.36) APEX1HPGDALDH1A1KMT2APKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 153 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108701582-B Photosensitive stacked structure 富士胶片电子材料美国有限公司 2023-05-02 CN claimed
CN-108027563-B Photosensitive polyimide composition 富士胶片电子材料美国有限公司 2021-12-03 CN claimed
JP-60035012-A None JP disclosed
CN-119220141-A Rosin modified acrylic ester paint 深圳市亮一彩环保科技有限公司 2024-12-31 CN disclosed
CN-113396127-B Curable composition for flexible hard coating 日产化学株式会社 2024-07-02 CN disclosed
CN-112912993-B Method for manufacturing semiconductor device 株式会社大赛璐 2024-06-11 CN disclosed
CN-117916283-A Curable conductive composition 贺利氏电子化学材料有限公司 2024-04-19 CN disclosed
CN-117777774-A Active energy ray-curable composition, cured product, and film DIC株式会社 2024-03-29 CN disclosed
CN-117777773-A Active energy ray-curable composition, cured product, and film DIC株式会社 2024-03-29 CN disclosed
CN-220584520-U Optical filter, imaging device, camera module, and optical sensor JSR株式会社 2024-03-12 CN disclosed
CN-112574457-B Window covering film and flexible display panel including the same SK新技术株式会社 2024-02-23 CN disclosed
US-20050148704-A1 CLEARCOAT INSITU RHEOLOGY CONTROL VIA UV CURED OLIGOMERIC ADDITIVE NETWORK SYSTEM FORD GLOBAL TECHNOLOGIES, LLC (US) 2005-07-07 US disclosed
US-6908644-B2 Clearcoat insitu rheology control via UV cured oligomeric additive network system FORD GLOBAL TECHNOLOGIES, LLC (US) 2005-06-21 US disclosed
EP-1445035-A2 A photocurable composition and a method of applying same Ford Global Technologies, LLC (US) 2004-08-11 EP disclosed
US-20040151843-A1 CLEARCOAT INSITU RHEOLOGY CONTROL VIA UV CURED OLIGOMERIC ADDITIVE NETWORK SYSTEM FORD GLOBAL TECHNOLOGIES, INC, (US) 2004-08-05 US disclosed
WO-2003027191-A2 CURABLE LIQUID RESIN COMPOSITION DSM IP ASSETS B.V. (NL) 2003-04-03 WO disclosed
EP-1165682-A1 RESIN COMPOSITION AND CURED PRODUCT DSM N.V. (NL) 2002-01-02 EP disclosed
WO-2001012690-A1 RESIN COMPOSITION COMPRISING PARTICLES DSM N.V. (NL) 2001-02-22 WO disclosed
WO-2000047666-A1 RESIN COMPOSITION AND CURED PRODUCT DSM N.V. (NL) 2000-08-17 WO disclosed
JP-S6035012-A RESIN COMPOSITION NIPPON SHOKUBAI KAGAKU KOGYO CO LTD 1985-02-22 JP disclosed