Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bicarbonate SCHEMBL3257312 | 0.81 | — | — | |
| SCHEMBL1965964 | 0.74 | — | — | |
| SCHEMBL15437 | 0.72 | CYP2C19 (0.33) | CYP2C19 | |
| SCHEMBL2786359 | 0.70 | CYP2C19 (0.32) | CYP2C19 | |
| SCHEMBL475699 | 0.69 | — | — | |
| SCHEMBL16505085 | 0.68 | — | — | |
| SCHEMBL11059449 | 0.67 | KDM5A (0.35) | — | |
| SCHEMBL15484211 | 0.66 | KDM5A (0.36) | — | |
| SCHEMBL28025374 | 0.66 | CYP2C19 (0.31) | CYP2C19 | |
| SCHEMBL28013258 | 0.65 | EPHX1 (0.39) | CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0540027-B1 | Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups | DAICEL CHEM (JP) | 1999-06-09 | — | — | EP | disclosed |
| EP-0859021-A2 | Epoxidised compositions | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1998-08-19 | — | — | EP | disclosed |
| US-5494977-A | A CURABLE EPOXIDIZED POLYESTER, ADDITION POLYMER OR ADDITION-CONDENSATION COPOLYMER FORMED WITH AN ANHYDRIDE STARTING COMPOUND; SOFTENING TEMPERATURE; INKS, COATINGS, VARNISHES | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1996-02-27 | — | — | US | disclosed |
| EP-0540027-A2 | Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1993-05-05 | — | — | EP | disclosed |