SCHEMBL8401951

SCHEMBL8401951

CC1CC2OC2CC1CC1CC2OC2CC1C(=O)O

nearest known ligand 0.40

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PPP5C P53041 1/20 0.40
GABRR1 P24046 4/20 0.37
GABRR2 P28476 1/20 0.37
KDM4E B2RXH2 1/20 0.31
GMNN O75496 1/20 0.31
LMNA P02545 1/20 0.31
PMP22 Q01453 1/20 0.31
TFPI2 P48307 1/20 0.31
TP53 P04637 1/20 0.31
TSHR P16473 1/20 0.31
NFKB1 P19838 1/20 0.31
THPO P40225 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bicarbonate SCHEMBL3257313 0.87 PPP5C (0.41) PPP5CKDM4EGMNNLMNAPMP22
SCHEMBL12667683 0.83 GABRR1 (0.52) GABRR1GABRR2
SCHEMBL1965966 0.81 PPP5C (0.30) PPP5C
SCHEMBL1648856 0.79 PPP5C (0.48) PPP5CGABRR1GABRR2KDM4EGMNN
SCHEMBL693235 0.79 PPP5C (0.48) PPP5CGABRR1GABRR2KDM4EGMNN
SCHEMBL25419147 0.78 GABRR1 (0.42) PPP5CGABRR1GABRR2KDM4EGMNN
Formic Acid SCHEMBL29049619 0.78 PPP5C (0.32) PPP5C
Ethylene Glycol SCHEMBL11275449 0.77 PPP5C (0.43) PPP5CGABRR1GABRR2KDM4EGMNN
SCHEMBL15667572 0.76 PPP5C (0.49) PPP5CKDM4EGMNNLMNAPMP22
SCHEMBL8749929 0.74 PPP5C (0.36) PPP5CGABRR1GABRR2KDM4EGMNN

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108474896-A Photocurable adhesive agent and the polarization plates and laminated optical component for having used the Photocurable adhesive agent 住友化学株式会社 2018-08-31 CN disclosed
CN-107429210-A Medical apparatus, fluorine-containing cyclic olefin polymer, fluorine-containing cyclic olefin polymer composition and cell culture processes 三井化学株式会社 2017-12-01 CN disclosed
EP-0540027-B1 Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups DAICEL CHEM (JP) 1999-06-09 EP disclosed
EP-0859021-A2 Epoxidised compositions DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-08-19 EP disclosed
US-5510428-A Compositions, epoxized compositions, a heat curable resin composition, an epoxy resin composition, radically polymerized compositions, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-04-23 US disclosed
US-5494977-A A CURABLE EPOXIDIZED POLYESTER, ADDITION POLYMER OR ADDITION-CONDENSATION COPOLYMER FORMED WITH AN ANHYDRIDE STARTING COMPOUND; SOFTENING TEMPERATURE; INKS, COATINGS, VARNISHES DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-02-27 US disclosed
EP-0540027-A2 Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-05-05 EP disclosed