Methyl Alcohol

Methyl Alcohol

SCHEMBL8419067

CO.C[Ti](C)(C)(C)(C)C1=CC=CC1

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methyl Alcohol SCHEMBL8040458 1.00
Methyl Alcohol SCHEMBL6933935 1.00
SCHEMBL140408 0.95
Hydrochloric Acid SCHEMBL138586 0.92
Bromide SCHEMBL1539655 0.92
Hydrochloric Acid SCHEMBL3671309 0.92
Hydrochloric Acid SCHEMBL812504 0.92
Fluoride SCHEMBL7642597 0.92
Fluoride SCHEMBL1131129 0.92
Iodide SCHEMBL1539699 0.92

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101657325-B Porous inorganic/organic hybrid particles with high organic content and enhanced pore geometry for chromatographic separations WATERS TECHNOLOGIES CORP US 2013-11-20 CN claimed
CN-101657325-A Porous inorganic/organic hybrid particles with high organic content and enhanced pore geometry for chromatographic separations WATERS TECHNOLOGIES CORP US 2010-02-24 CN claimed
CN-103551132-A Porous inorganic/organic hybrid particles having high organic content and enhanced pore geometry for chromatographic separations WATERS TECHNOLOGIES CORP 2014-02-05 CN disclosed
CN-101657325-B Porous inorganic/organic hybrid particles with high organic content and enhanced pore geometry for chromatographic separations WATERS TECHNOLOGIES CORP US 2013-11-20 CN disclosed
CN-102375336-B Manufacturing method of photosensitive resin composition and solidified embossing pattern, and semiconductor device ASAHI KASEI E MATERIALS CORP 2013-10-09 CN disclosed
CN-102162996-B Manufacture method for negative type photosensitive resin composition and cured relief pattern ASAHI KASEI E MATERIALS CORP 2013-07-17 CN disclosed
CN-102375336-A Manufacturing Method Of Photosensitive Resin Composition And Solidified Embossing Pattern, And Semiconductor Device ASAHI KASEI E MATERIALS CORP 2012-03-14 CN disclosed
CN-102162996-A Manufacture method for negative type photosensitive resin composition and cured relief pattern ASAHI KASEI E MATERIALS CORP 2011-08-24 CN disclosed
CN-101657325-A Porous inorganic/organic hybrid particles with high organic content and enhanced pore geometry for chromatographic separations WATERS TECHNOLOGIES CORP US 2010-02-24 CN disclosed
CN-1289614-C Substance for forming electrically-conducting film and electrically-conducting film and its manufacturing method JSR CORP (JP) 2006-12-13 CN disclosed
CN-1461779-A Substance for forming electrically-conducting film and electrically-conducting film and its manufacturing method JSR CORP (JP) 2003-12-17 CN disclosed
US-5962202-A DEVELOPING THE BLACK-AND-WHITE PHOTOGRAPHIC LIGHT-SENSITIVE MATERIAL CONTAINING A QUATERNARY ONIUM COMPOUND WITH A DEVELOPER CONTAINING ASCORBIC ACID OR A DERIVATIVE THEREOF AND A MERCAPTAN KONICA CORPORATION (JP) 1999-10-05 US disclosed
EP-0846981-A1 Method for processing black-and-white silver halide photographic light-sensitive material KONICA CORPORATION (JP) 1998-06-10 EP disclosed