⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1948809 | 0.84 | MAPK1 (0.30) | — | |
| SCHEMBL15091912 | 0.75 | — | — | |
| SCHEMBL5704046 | 0.73 | MAPK1 (0.30) | — | |
| SCHEMBL475699 | 0.71 | — | — | |
| SCHEMBL6682939 | 0.68 | PPM1B (0.34) | — | |
| SCHEMBL28192958 | 0.68 | GABRR1 (0.33) | — | |
| SCHEMBL14796415 | 0.65 | — | — | |
| SCHEMBL4396295 | 0.64 | SLC1A2 (0.33) | — | |
| SCHEMBL28184038 | 0.63 | PPP5C (0.37) | — | |
| SCHEMBL13269289 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12584036-B2 | Ink ejection device | Konica Minolta, Inc. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-3381667-B1 | MOLDING APPARATUS, MANUFACTURING METHOD, AND FIBER-REINFORCED RESIN MATERIAL | ADEKA CORP (JP) | 2026-02-18 | — | — | EP | disclosed |
| US-12473470-B2 | Photocurable adhesive | DENSO CORPORATION (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12473472-B2 | Photocurable adhesive | DENSO CORPORATION (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12435176-B2 | Curable resin composition | ADEKA CORPORATION (JP) | 2025-10-07 | — | — | US | disclosed |
| US-20250163281-A1 | THERMOPLASTIC RESIN COMPOSITION FOR FUSED DEPOSITION MODELING, MODELED BODY, AND METHOD FOR PRODUCING SAME | ADEKA CORPORATION (JP) | 2025-05-22 | — | — | US | disclosed |
| EP-3878917-B1 | CURABLE RESIN COMPOSITION | ADEKA CORP (JP) | 2025-05-14 | — | — | EP | disclosed |
| US-20250145874-A1 | CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2025-05-08 | — | — | US | disclosed |
| WO-2025062839-A1 | COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, MATERIAL FOR RECYCLING, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING DECOMPOSITION PRODUCT, AND DECOMPOSITION METHOD | 株式会社ADEKA | 2025-03-27 | — | — | WO | disclosed |
| WO-2025047655-A1 | BLOCK URETHANE MATERIAL, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND BLOCK URETHANE COMPOUND CONTAINED THEREIN | 株式会社ADEKA | 2025-03-06 | — | — | WO | disclosed |
| US-20100297357-A1 | One-Component Epoxy Coating Compositions | PPG INDUSTRIES OHIO, INC. | 2010-11-25 | — | — | US | disclosed |
| WO-2010135730-A2 | ONE-COMPONENT EPOXY COATING COMPOSITIONS | PPG INDUSTRIES OHIO, INC. (US) | 2010-11-25 | — | — | WO | disclosed |
| US-20100204410-A1 | ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2010-08-12 | — | — | US | disclosed |
| US-20090163649-A1 | One-Part Type Heat Curable Composition | SIKA TECHNOLOGY AG (CH) | 2009-06-25 | — | — | US | disclosed |
| EP-1666531-B1 | ACRYLIC SOL COMPOSITION | ADEKA CORP (JP) | 2008-07-02 | — | — | EP | disclosed |
| US-7226981-B2 | Curing agent composition for epoxy resin | ASAHI DENKA CO., LTD. (JP) | 2007-06-05 | — | — | US | disclosed |
| US-20060173110-A1 | Acrylic sol composition | ASAHI DENKA CO., LTD. (JP) | 2006-08-03 | — | — | US | disclosed |
| EP-1666531-A1 | ACRYLIC SOL COMPOSITION | Asahi Denka Co., Ltd. (JP) | 2006-06-07 | — | — | EP | disclosed |
| US-20040236061-A1 | Curing agent composition for epoxy resin | ASAHI DENKA CO., LTD. (JP) | 2004-11-25 | — | — | US | disclosed |
| US-5532324-A | BISPHENOL A AND P,P-DIHYDROXYBIPHENYL, CHEMICAL RESISTANCE, HEAT RESISTANCE, FLAME RETARDANCY | CITIBANK, N.A., AS COLLATERAL AGENT | 1996-07-02 | — | — | US | disclosed |