SCHEMBL845023

SCHEMBL845023

CC[Si](CC)(CCC1CCC2OC2C1)OC

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.33
PTGS2 P35354 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12098230 0.91 PTGS1 (0.32) PTGS1PTGS2
SCHEMBL845272 0.86 PTGS1 (0.30) PTGS1PTGS2
SCHEMBL844736 0.84 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL17530137 0.84 PTGS1 (0.31) PTGS1PTGS2
SCHEMBL17530138 0.83 PTGS1 (0.30) PTGS1PTGS2
SCHEMBL4878967 0.81 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL16020793 0.81 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL20658091 0.81 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL48081 0.81 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL202671 0.81 PTGS1 (0.35) PTGS1PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 126 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10808152-B2 Adhesive composition and adhesive sheet using same DAI NIPPON PRINTING CO., LTD. (JP) 2020-10-20 US claimed
US-7256238-B2 Modified block copolymer ASAHI KASEI CHEMICALS CORPORATION (JP) 2007-08-14 US claimed
EP-1199313-B1 Diene polymers and copolymers having an alkoxysilane group BRIDGESTONE CORP (JP) 2005-08-24 EP claimed
CN-119731283-A Adhesive sheet, adhesive composition, and structure 大日本印刷株式会社 2025-03-28 CN disclosed
CN-113831676-B Antistatic resin composition, method for producing antistatic resin composition, and electronic component packaging material 旭化成株式会社 2024-11-05 CN disclosed
CN-118574883-A Rubber formulation comprising functionalized conjugated diene polymer, natural rubber and reinforcing filler 株式会社普利司通 2024-08-30 CN disclosed
EP-2902441-B1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CURED RESIN PRODUCT, AND METHOD FOR CAUSING SELF-POLYMERIZATION OF EPOXY COMPOUND MITSUBISHI CHEM CORP (JP) 2024-05-01 EP disclosed
WO-2024053614-A1 ADHESIVE SHEET, ADHESIVE AGENT COMPOSITION, AND STRUCTURE 大日本印刷株式会社 2024-03-14 WO disclosed
CN-117545808-A A resin composition method for producing resin composition and molded article 旭化成株式会社 2024-02-09 CN disclosed
CN-117480273-A Primer composition for vapor deposition of inorganic oxide, cured product, and laminate DIC株式会社 2024-01-30 CN disclosed
CN-117362906-A ABS resin composition, molded article, and coated molded article 旭化成株式会社 2024-01-09 CN disclosed
EP-1403317-A1 MODIFIED BLOCK COPOLYMER COMPOSITION Asahi Kasei Kabushiki Kaisha (JP) 2004-03-31 EP disclosed
EP-1199313-A2 Diene polymers and copolymers having an alkoxysilane group Bridgestone Corporation (JP) 2002-04-24 EP disclosed
EP-0767179-B1 Method for producing a rubber composition BRIDGESTONE CORP (JP) 2001-06-27 EP disclosed
US-6117927-A MODIFYING TERMINAL OF A DIENE RUBBER WITH A SILANE MODIFIER HAVING A SPECIFIC FUNCTIONALITY, BRIDGESTONE CORPORATION (JP) 2000-09-12 US disclosed
EP-0661298-B1 Diene polymers and copolymers having an alkoxysilane group BRIDGESTONE CORP (JP) 1999-03-17 EP disclosed
EP-0773231-A2 Diene polymers and copolymers having an alkoxysilane group Bridgestone Corporation (JP) 1997-05-14 EP disclosed
EP-0767179-A2 Method for producing a rubber composition Bridgestone Corporation (JP) 1997-04-09 EP disclosed
US-5508333-A NONCRACKING, WEAR RESISTANCE, HYSTERESIS-FREE; TIRES BRIDGESTONE CORPORATION (JP) 1996-04-16 US disclosed
EP-0661298-A2 Diene polymers and copolymers having an alkoxysilane group BRIDGESTONE CORPORATION (JP) 1995-07-05 EP disclosed