SCHEMBL8510286

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nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compound	similarity	top predicted	shared targets
SCHEMBL29366439	1.00	—	—
SCHEMBL151515	1.00	—	—
SCHEMBL4574627	1.00	—	—
SCHEMBL11026714	1.00	—	—
SCHEMBL8912718	1.00	—	—
SCHEMBL25299932	0.82	—	—
SCHEMBL1813974	0.82	—	—
SCHEMBL3800358	0.82	—	—
SCHEMBL25299989	0.82	—	—
Hydrochloric Acid SCHEMBL8058676	0.82	—	—

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

Patent	Title	Assignee	Published	Priority	Filing	Country	Status
EP-0489335-A1	Insulated mold structure with multilayered metal skin	GENERAL ELECTRIC COMPANY (US)	1992-06-10	—	—	EP	claimed
EP-0640458-B1	Insulated mold structure for injection molding of optical disks	GEN ELECTRIC (US)	1999-04-21	—	—	EP	disclosed
WO-1996002941-A1	METAL COVER FOR CERAMIC PACKAGE AND METHOD OF MAKING SAME	JOHNSON MATTHEY ELECTRONICS, INC. (US)	1996-02-01	—	—	WO	disclosed
US-5458818-A	Insulated mold structure for injection molding of optical disks	GENERAL ELECTRIC CO. (US)	1995-10-17	—	—	US	disclosed
EP-0640458-A1	Insulated mold structure for injection molding of optical disks	GENERAL ELECTRIC COMPANY (US)	1995-03-01	—	—	EP	disclosed
WO-1994024702-A1	METAL COVER FOR CERAMIC PACKAGE AND METHOD OF MAKING SAME	JOHNSON MATTHEY ELECTRONICS, INC. (US)	1994-10-27	—	—	WO	disclosed
EP-0489335-A1	Insulated mold structure with multilayered metal skin	GENERAL ELECTRIC COMPANY (US)	1992-06-10	—	—	EP	disclosed