SCHEMBL8563669

SCHEMBL8563669

CCCCc1cc(C2(C3=CC(=O)NC3=O)CC(C(C)C)CCC2(C)C2=CC(=O)NC2=O)c(C)cc1Oc1ccc(N)cc1

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
PPARG P37231 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8559585 0.93 PPARG (0.30) PPARG
SCHEMBL8632336 0.82 BRD4 (0.31)
SCHEMBL8560023 0.81 BACE1 (0.31)
SCHEMBL8562416 0.80
SCHEMBL8631822 0.79
SCHEMBL8559661 0.79 CYP19A1 (0.31)
SCHEMBL8567068 0.74 BACE1 (0.30)
SCHEMBL8972896 0.74
SCHEMBL8561047 0.73 ATM (0.38)
SCHEMBL8633775 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5780145-A CURED EPXOY AND OR IMIDE RESINS WITH FILLERS AND GLOBULAR POWDER WITH SPECIFIC PARTICLE SIZE USED AS A SEALING MATERIALS FOR SEMICONDUCTORS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-07-14 US disclosed
US-5719225-A RESIN COMPOSITION CONTAINING FILLER COMPRISING GLOBULAR POWDERS OF DIFFERENT PARTICLE SIZES IN SPECIFIED RATIOS SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1998-02-17 US disclosed