SCHEMBL85727

SCHEMBL85727

C[Si](C)(C)C[Si](C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Iodide SCHEMBL25276934 0.94
SCHEMBL8736863 0.94
SCHEMBL8167765 0.94
SCHEMBL8167773 0.94
SCHEMBL12375242 0.78
SCHEMBL12677812 0.71
SCHEMBL3157385 0.71
SCHEMBL996456 0.71
SCHEMBL23794966 0.71
SCHEMBL2686967 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2808 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122039018-A Method for producing amorphous carbon-containing film and article 乔治洛德方法研究和开发液化空气有限公司 2026-05-15 CN claimed
CN-122056125-A RF pulsed assisted low-K film deposition with high mechanical strength 应用材料公司 2026-05-15 CN claimed
US-12571107-B2 Nanocomposite coating material for rollers of secondary battery electrode manufacturing equipment and manufacturing system thereof INNOTION TECH CO., LTD. (KR) 2026-03-10 US claimed
WO-2025264567-A1 LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT APPLIED MATERIALS, INC. (US) 2025-12-26 WO claimed
US-20250391656-A1 LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT APPLIED MATERIALS INC (US) 2025-12-25 US claimed
US-20250374580-A1 LOW K INNER SPACER FORMATION BY SELECTIVE PECVD PROCESS IN GATE-ALL-AROUND (GAA) NANOSHEET DEVICE APPLIED MATERIALS INC (US) 2025-12-04 US claimed
US-20250357107-A1 RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY APPLIED MATERIALS, INC. (US) 2025-11-20 US claimed
WO-2025075893-A1 METHODS FOR FORMING LOW-Κ DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND ENHANCED ELECTRICAL PROPERTIES APPLIED MATERIALS, INC. (US) 2025-04-10 WO claimed
US-20250112038-A1 METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND ENHANCED ELECTRICAL PROPERTIES APPLIED MATERIALS, INC. (US) 2025-04-03 US claimed
WO-2025049147-A1 METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH APPLIED MATERIALS, INC. (US) 2025-03-06 WO claimed
EP-0793679-B1 ETHYLENE HOMOPOLYMERIZATION USING GROUP 3 METAL COMPLEXES DOW CHEMICAL CO (US) 1998-11-25 EP claimed
US-5708101-A METALLOCENES CALIFORNIA INSTITUTE OF TECHNOLOGY (US) 1998-01-13 US claimed
US-5698634-A Process for preparing block copolymer of monoolefin MITSUI TOATSU CHEMICALS, INC. (JP) 1997-12-16 US claimed
EP-0793679-A1 ETHYLENE HOMOPOLYMERIZATION USING GROUP 3 METAL COMPLEXES THE DOW CHEMICAL COMPANY (US) 1997-09-10 EP claimed
US-5605998-A Method for producing polycarbosilanes DIRECTOR-GENERAL OF AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 1997-02-25 US claimed
WO-1996016095-A1 ETHYLENE HOMOPOLYMERIZATION USING GROUP 3 METAL COMPLEXES THE DOW CHEMICAL COMPANY (US) 1996-05-30 WO claimed
US-5464906-A Polymerization catalyst THE DOW CHEMICAL COMPANY (US) 1995-11-07 US claimed
EP-0634429-A1 Process for preparing block copolymer of monoolefin MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-01-18 EP claimed
US-4965386-A REACTING WITH ALPHA-OLEFINS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1990-10-23 US claimed
US-4596741-A Amorphous silicon carbide coating produced by exposing carbon fibers to low temperature plasma of organosilicon compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 1986-06-24 US claimed