⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13083493 | 0.74 | — | — | |
| SCHEMBL9191958 | 0.74 | — | — | |
| SCHEMBL18085532 | 0.70 | — | — | |
| SCHEMBL18085540 | 0.70 | — | — | |
| SCHEMBL381654 | 0.70 | — | — | |
| SCHEMBL260698 | 0.70 | — | — | |
| SCHEMBL6327496 | 0.69 | — | — | |
| Ethyne SCHEMBL1261705 | 0.69 | TSHR (0.62) | — | |
| SCHEMBL4623846 | 0.67 | — | — | |
| SCHEMBL15245 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2435502-B1 | CURABLE SILYL-GROUP CONTAINING COMPOSITIONS AND ITS USE | EVONIK DEGUSSA GMBH (DE) | 2016-10-19 | — | — | EP | claimed |
| EP-1885911-B1 | SOL FOR SOL-GEL PROCESS COATING OF A SURFACE AND COATING METHOD BY SOL-GEL PROCESS USING SAME | AIRBUS OPERATIONS SAS (FR) | 2012-03-28 | — | — | EP | claimed |
| EP-1885911-A2 | SOL FOR SOL-GEL PROCESS COATING OF A SURFACE AND COATING METHOD BY SOL-GEL PROCESS USING SAME | AIRBUS France (FR) | 2008-02-13 | — | — | EP | claimed |
| WO-2007003828-A2 | SOL FOR SOL-GEL PROCESS COATING OF A SURFACE AND COATING METHOD BY SOL-GEL PROCESS USING SAME | AIRBUS FRANCE (FR) | 2007-01-11 | — | — | WO | claimed |
| EP-2872457-B1 | TRANSLUCENT GLAZING COMPRISING AT LEAST ONE PATTERN THAT IS PREFERABLY TRANSPARENT | SAINT GOBAIN (FR) | 2019-01-09 | — | — | EP | disclosed |
| WO-2016172092-A1 | PHOTOSENSITIVE POLYIMIDE COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2016-10-27 | — | — | WO | disclosed |
| EP-2872328-B1 | TRANSPARENT ELEMENT WITH DIFFUSE REFLECTION, COMPRISING A SOL-GEL LAYER | SAINT GOBAIN (FR) | 2016-06-29 | — | — | EP | disclosed |
| EP-2872457-A1 | TRANSLUCENT GLAZING COMPRISING AT LEAST ONE PATTERN THAT IS PREFERABLY TRANSPARENT | Saint-Gobain Glass France (FR) | 2015-05-20 | — | — | EP | disclosed |
| EP-2872328-A1 | TRANSPARENT ELEMENT WITH DIFFUSE REFLECTION, COMPRISING A SOL-GEL LAYER | Saint-Gobain Glass France (FR) | 2015-05-20 | — | — | EP | disclosed |
| US-9012022-B2 | Polymer coatings | ILLUMINA, INC. (US) | 2015-04-21 | — | — | US | disclosed |
| US-9012022-B2 | Polymer coatings | ILLUMINA, INC. (US) | 2015-04-21 | — | — | US | disclosed |
| US-20140079923-A1 | POLYMER COATINGS | ILLUMINA, INC. | 2014-03-20 | — | — | US | disclosed |
| US-20060199920-A1 | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof | KANEKA CORPORATION (JP) | 2006-09-07 | — | — | US | disclosed |
| US-20060142542-A1 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |
| EP-1640399-A1 | POLYCARBONATE OR POLYESTER HAVING REACTIVE SILICON-CONTAINING GROUP AND ORGANIC/INORGANIC HYBRID POLYMERIC MATERIAL | Orient Chemical Industries, Ltd. (JP) | 2006-03-29 | — | — | EP | disclosed |
| CN-1599884-A | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEGAFUCHI CHEMICAL IND (JP) | 2005-03-23 | — | — | CN | disclosed |
| US-20040235992-A1 | Photosensitive resin composition and photosensitive dry film resist and photosensitive coverlay film produced therefrom | KANEKA CORPORATION (JP) | 2004-11-25 | — | — | US | disclosed |
| CN-1522387-A | Photosensitive resin composition, and photosensitive dry film resist and photosensitive coverlay film using the same | 钟渊化学工业株式会社 | 2004-08-18 | — | — | CN | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |