SCHEMBL8604903

SCHEMBL8604903

CC(CC(=O)O)C(CC(=O)O)C(=O)O

nearest known ligand 0.65

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.65
SMN1; SMN2 Q16637 1/20 0.42
SLC22A6 Q4U2R8 1/20 0.39
SLC1A3 P43003 1/20 0.38
SLC1A2 P43004 1/20 0.38
SLC1A1 P43005 1/20 0.38
CYP1A2 P05177 1/20 0.37
CACNA2D1 P54289 2/20 0.37
CACNB3 P54284 1/20 0.37
CACNA1C Q13936 1/20 0.37
PGR P06401 1/20 0.37
ADRA1A P35348 1/20 0.37
HTR2B P41595 1/20 0.37
CACNA2D2 Q9NY47 1/20 0.37
TP53 P04637 1/20 0.36
FOLH1 Q04609 1/20 0.36
MAPT P10636 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5968226 0.85 TDP1 (0.52) TDP1SMN1; SMN2SLC22A6SLC1A3SLC1A2
SCHEMBL706537 0.85 TDP1 (0.59) TDP1SMN1; SMN2SLC22A6SLC1A3SLC1A2
SCHEMBL11453177 0.83 TDP1 (0.50) TDP1SMN1; SMN2SLC22A6SLC1A3SLC1A2
SCHEMBL7946373 0.83 TDP1 (0.56) TDP1SMN1; SMN2SLC1A3SLC1A2SLC1A1
SCHEMBL706230 0.81 TDP1 (0.54) TDP1SMN1; SMN2SLC1A3SLC1A2SLC1A1
SCHEMBL554957 0.81 TDP1 (0.68) TDP1SMN1; SMN2SLC22A6SLC1A3SLC1A2
SCHEMBL5514949 0.81 TDP1 (0.68) TDP1SMN1; SMN2SLC22A6SLC1A3SLC1A2
SCHEMBL14803500 0.81 TDP1 (0.68) TDP1SMN1; SMN2SLC22A6SLC1A3SLC1A2
SCHEMBL3730369 0.81 TDP1 (0.48) TDP1SMN1; SMN2SLC22A6SLC1A3SLC1A2
SCHEMBL17517216 0.80 TDP1 (1.00) TDP1SMN1; SMN2SLC22A6FOLH1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12386265-B2 Pattern forming method and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2025-08-12 US disclosed
US-12097996-B2 Container, method for manufacturing container, and chemical liquid storage body FUJIFILM CORPORATION (JP) 2024-09-24 US disclosed
US-20240295822-A1 PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2024-09-05 US disclosed
US-12013644-B2 Method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-06-18 US disclosed
WO-2023164002-A1 ELECTROLYTE ADDITIVE COMPOUNDS FOR HIGH VOLTAGE ENERGY STORAGE DEVICE, AND ASSOCIATED PROCESSES TESLA, INC. (US) 2023-08-31 WO disclosed
US-20220121123-A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2022-04-21 US disclosed
US-11256173-B2 Treatment liquid for manufacturing semiconductor and pattern forming method FUJIFILM CORPORATION (JP) 2022-02-22 US disclosed
US-20200115105-A1 CONTAINER, METHOD FOR MANUFACTURING CONTAINER, AND CHEMICAL LIQUID STORAGE BODY FUJIFILM CORPORATION (JP) 2020-04-16 US disclosed
US-20190025702-A1 TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2019-01-24 US disclosed
CN-108885412-A Processing liquid for semiconductor manufacturing and pattern forming method 富士胶片株式会社 2018-11-23 CN disclosed
EP-0547578-B1 Light-sensitive composition FUJI PHOTO FILM CO LTD (JP) 1998-03-18 EP disclosed
US-5424165-A Printing durability, storage stability FUJI PHOTO FILM CO., LTD. (JP) 1995-06-13 US disclosed
EP-0547578-A1 Light-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 1993-06-23 EP disclosed