Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PBRM1 | Q86U86 | 1/20 | 0.54 |
| ▸ | MAOB | P27338 | 1/20 | 0.53 |
| ▸ | CTNNB1 | P35222 | 1/20 | 0.51 |
| ▸ | MAPT | P10636 | 2/20 | 0.47 |
| ▸ | GAA | P10253 | 1/20 | 0.47 |
| ▸ | F10 | P00742 | 2/20 | 0.47 |
| ▸ | ELANE | P08246 | 1/20 | 0.46 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.45 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.43 |
| ▸ | SRC | P12931 | 1/20 | 0.43 |
| ▸ | TGFBR1 | P36897 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | USP2 | O75604 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
| ▸ | GLA | P06280 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.43 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8736730 | 0.94 | PBRM1 (0.50) | PBRM1MAOBCTNNB1MAPTGAA | |
| SCHEMBL30646149 | 0.94 | PBRM1 (0.50) | PBRM1MAOBCTNNB1MAPTGAA | |
| SCHEMBL30846866 | 0.90 | PBRM1 (0.50) | PBRM1MAOBCTNNB1MAPTGAA | |
| SCHEMBL8974398 | 0.90 | PBRM1 (0.50) | PBRM1MAOBCTNNB1MAPTGAA | |
| SCHEMBL10390479 | 0.90 | AKR1C3 (0.57) | PBRM1MAOBCTNNB1F10AKR1C3 | |
| SCHEMBL29363351 | 0.89 | MAOB (0.53) | PBRM1MAOBCTNNB1MAPTGAA | |
| SCHEMBL28539202 | 0.89 | MAOB (0.53) | PBRM1MAOBCTNNB1MAPTGAA | |
| SCHEMBL6160821 | 0.88 | MAOB (0.44) | PBRM1MAOBCTNNB1MAPTGAA | |
| SCHEMBL9289398 | 0.86 | MAOB (0.58) | MAOBCTNNB1MAPTF10AKR1C3 | |
| SCHEMBL8837241 | 0.86 | MAOB (0.41) | PBRM1MAOBCTNNB1MAPTGAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113045776-B | High heat-resistant polyimide powder for 3D printing and preparation method thereof | 黄山金石木塑料科技有限公司 | 2023-08-04 | — | — | CN | claimed |
| CN-113045776-A | High-heat-resistance polyimide powder for 3D printing and preparation method thereof | 黄山金石木塑料科技有限公司 | 2021-06-29 | — | — | CN | claimed |
| CN-118240361-A | Resin composition | 南亚塑胶工业股份有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-118063769-A | Polyimide resin | 住友化学株式会社 | 2024-05-24 | — | — | CN | disclosed |
| CN-117986861-A | Resin composition and electronic component | 南亚塑胶工业股份有限公司 | 2024-05-07 | — | — | CN | disclosed |
| CN-117794048-A | Metal-clad laminate, circuit board, electronic device, and electronic apparatus | 日铁化学材料株式会社 | 2024-03-29 | — | — | CN | disclosed |
| CN-111746080-B | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-115971017-B | Method for producing polyimide film, method for producing metal-clad laminate, and method for producing circuit board | 日铁化学材料株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-117279198-A | Metal-clad laminate, circuit board, electronic device, and electronic apparatus | 日铁化学材料株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-117210002-A | Resin film, coverlay film, circuit board, resin-coated copper foil, metal-clad laminate, and multilayer circuit board | 日铁化学材料株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-117067718-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2023-11-17 | — | — | CN | disclosed |
| CN-112469560-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-111746080-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2020-10-09 | — | — | CN | disclosed |
| CN-111132456-A | Metal-clad laminate, circuit board, multilayer circuit board, and method for manufacturing same | 日铁化学材料株式会社 | 2020-05-08 | — | — | CN | disclosed |
| CN-110962410-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2020-04-07 | — | — | CN | disclosed |
| CN-110964319-A | Resin film, polyimide, adhesive resin composition, and use thereof | 日铁化学材料株式会社 | 2020-04-07 | — | — | CN | disclosed |
| CN-110871606-A | Metal-clad laminate, adhesive sheet, adhesive polyimide resin composition, and circuit board | 日铁化学材料株式会社 | 2020-03-10 | — | — | CN | disclosed |
| CN-104519657-B | Copper-cover laminated plate, printing distributing board and its application method | 新日铁住金化学株式会社 | 2018-04-06 | — | — | CN | disclosed |
| CN-105860074-A | Polyimide precursor solution, preparation method thereof and method of utilizing polyimide precursor solution to prepare polyimide thin film | 黑龙江省科学院石油化学研究院 | 2016-08-17 | — | — | CN | disclosed |
| US-5821319-A | COMPRISING STRUCTURAL UNITS DERIVED FROM PYROMELLITIC ANHYDRIDE, TEREPHTHALOYL CHLORIDE, 1,3-BIS/4-(4-AMINOPHENOXY)-ALPHA,ALPHA-DIMETHYLBENZYL/BENZENE | MITSUI CHEMICALS, INC. (JP) | 1998-10-13 | — | — | US | disclosed |