⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2397890 | 0.73 | — | — | |
| SCHEMBL4665460 | 0.69 | — | — | |
| SCHEMBL487549 | 0.69 | — | — | |
| SCHEMBL6163877 | 0.67 | — | — | |
| SCHEMBL834004 | 0.67 | — | — | |
| SCHEMBL4244695 | 0.67 | — | — | |
| SCHEMBL7456365 | 0.67 | — | — | |
| SCHEMBL834003 | 0.67 | — | — | |
| SCHEMBL11208542 | 0.67 | — | — | |
| SCHEMBL3802013 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107663044-B | Geopolymer type soft soil cementing agent and preparation method thereof | 武汉二航路桥特种工程有限责任公司 | 2020-04-17 | — | — | CN | claimed |
| US-4139499-A | Thermally reversible amphoteric ion exchange resins of improved demineralization capacity | ICI AUSTRALIA LIMITED (AU) | 1979-02-13 | — | — | US | claimed |
| US-4134815-A | Amphoteric composite resins and method of preparing same by polymerization of a two-phase dispersion of monomers | ICI AUSTRALIA LIMITED (AU) | 1979-01-16 | — | — | US | claimed |
| CN-107663044-B | Geopolymer type soft soil cementing agent and preparation method thereof | 武汉二航路桥特种工程有限责任公司 | 2020-04-17 | — | — | CN | disclosed |
| US-20150064552-A1 | COMPOSITE ANODE MATERIAL FOR A LITHIUM ION BATTERY AND PREPARATION METHOD THEREOF | DONGGUAN AMPEREX TECHNOLOGY LIMITED (CN) | 2015-03-05 | — | — | US | disclosed |
| EP-1865093-B1 | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating | JX NIPPON MINING & METALS CORP (JP) | 2012-03-28 | — | — | EP | disclosed |
| EP-1249517-B1 | METHOD OF COPPER ELECTROPLATING with pretreatment | NIPPON MINING CO (JP) | 2011-01-12 | — | — | EP | disclosed |
| EP-1865093-A1 | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating | Nippon Mining & Metals Co., Ltd. (JP) | 2007-12-12 | — | — | EP | disclosed |
| WO-2006077162-A1 | USE OF ANTI-MICROBIAL POLYMERS AS EMULSIFIERS AND ANTI-MICROBIAL POLYMER DISPERSIONS CONTAINING EMULSIFIERS | ALBERT-LUDWIGS-UNIVERSITÄT FREIBURG (DE) | 2006-07-27 | — | — | WO | disclosed |
| US-6562222-B1 | Copper sulfate, sulfuric acid, chlorine, silane coupling agent; semiconductors | NIKKO MATERIALS COMPANY, LIMITED (JP) | 2003-05-13 | — | — | US | disclosed |
| EP-1249517-A1 | COPPER ELECTROPLATING LIQUID, PRETREATMENT LIQUID FOR COPPER ELECTROPLATING AND METHOD OF COPPER ELECTROPLATING | Nikko Materials Company, Limited (JP) | 2002-10-16 | — | — | EP | disclosed |