SCHEMBL863250

SCHEMBL863250

C=C([Si](C)(OCC)OCC)[Si](C)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25186627 0.89
SCHEMBL14328018 0.87
SCHEMBL25183759 0.85
SCHEMBL25186609 0.85
SCHEMBL962808 0.80
SCHEMBL3950478 0.77
SCHEMBL3891180 0.74
SCHEMBL25179725 0.73 MAPT (0.33)
SCHEMBL137982 0.73
SCHEMBL25183119 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3172260-A2 HIGH GAIN DURABLE ANTI-REFLECTIVE COATING Enki Technology Inc. (US) 2017-05-31 EP claimed
WO-2016011071-A2 HIGH GAIN DURABLE ANTI-REFLECTIVE COATING Enki Technology, Inc. (US) 2016-01-21 WO claimed
US-8405192-B2 Low dielectric constant material TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2013-03-26 US claimed
US-20120074535-A1 LOW DIELECTRIC CONSTANT MATERIAL TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC") (TW) 2012-03-29 US claimed
CN-109071949-B Room temperature-curable organopolysiloxane composition and substrate coated with cured product of said composition 信越化学工业株式会社 2021-08-31 CN disclosed
EP-3456786-B1 ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND BASE COATED WITH CURED OBJECT OBTAINED FROM SAID COMPOSITION SHINETSU CHEMICAL CO (JP) 2021-05-26 EP disclosed
EP-3790616-A1 MEDICAL COMPONENTS WITH THERMOPLASTIC MOLDINGS BONDED TO SUBSTRATES Fisher & Paykel Healthcare Limited (NZ) 2021-03-17 EP disclosed
US-10590286-B2 Room-temperature-curable organopolysiloxane composition, and base member coated with cured object obtained from said composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-03-17 US disclosed
WO-2019216774-A1 MEDICAL COMPONENTS WITH THERMOPLASTIC MOLDINGS BONDED TO SUBSTRATES FISHER & PAYKEL HEALTHCARE LIMITED (NZ) 2019-11-14 WO disclosed
US-20190127593-A1 ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND BASE MEMBER COATED WITH CURED OBJECT OBTAINED FROM SAID COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-05-02 US disclosed
EP-3456786-A1 ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND BASE COATED WITH CURED OBJECT OBTAINED FROM SAID COMPOSITION Shin-Etsu Chemical Co., Ltd. (JP) 2019-03-20 EP disclosed
EP-3172260-A2 HIGH GAIN DURABLE ANTI-REFLECTIVE COATING Enki Technology Inc. (US) 2017-05-31 EP disclosed
WO-2016011071-A2 HIGH GAIN DURABLE ANTI-REFLECTIVE COATING Enki Technology, Inc. (US) 2016-01-21 WO disclosed
US-8405192-B2 Low dielectric constant material TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2013-03-26 US disclosed
US-20120074535-A1 LOW DIELECTRIC CONSTANT MATERIAL TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC") (TW) 2012-03-29 US disclosed
EP-0641820-B1 Organosilicon polymer and process for the preparation thereof TOSHIBA SILICONE (JP) 1998-08-12 EP disclosed
US-5489662-A Process for the preparation of organosilicon polymer TOSHIBA SILICONE CO., LTD. (JP) 1996-02-06 US disclosed
EP-0641820-A1 Process for the preparation of organosilicon polymer TOSHIBA SILICONE CO., LTD. (JP) 1995-03-08 EP disclosed