SCHEMBL8640989

SCHEMBL8640989

O=[SiH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL131891 0.67 — —
SCHEMBL18575207 0.58 — —
SCHEMBL18575195 0.58 — —
SCHEMBL18575365 0.58 — —
SCHEMBL18575238 0.58 — —
Charcoal, Activated SCHEMBL1535100 0.58 — —
SCHEMBL18575190 0.58 — —
SCHEMBL4454282 0.58 — —
SCHEMBL3989568 0.58 — —
Lithium SCHEMBL31707797 0.58 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0135887-B1 PHOTOCURABLE COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-04-06 — — EP claimed
US-4406764-A Photo-curable epoxy resin composition with organic aluminum and α-ketosilyl compounds TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1983-09-27 — — US claimed
JP-60071629-A — — None — — JP disclosed
JP-60071630-A — — None — — JP disclosed
CN-112292414-A Cation-curable composition and method for producing cured product 迪睿合株式会社 2021-01-29 — — CN disclosed
CN-101765631-B Process for preparing rubber compositions and articles made therefrom MOMENTIVE PERFORMANCE MAT INC 2013-06-12 — — CN disclosed
CN-101765631-A Process for preparing rubber compositions and articles made therefrom MOMENTIVE PERFORMANCE MAT INC 2010-06-30 — — CN disclosed
EP-0859021-A2 Epoxidised compositions DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-08-19 — — EP disclosed
US-5510428-A Compositions, epoxized compositions, a heat curable resin composition, an epoxy resin composition, radically polymerized compositions, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-04-23 — — US disclosed
US-5494977-A A CURABLE EPOXIDIZED POLYESTER, ADDITION POLYMER OR ADDITION-CONDENSATION COPOLYMER FORMED WITH AN ANHYDRIDE STARTING COMPOUND; SOFTENING TEMPERATURE; INKS, COATINGS, VARNISHES DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-02-27 — — US disclosed
US-5378736-A Epoxidized polylactone, coatings DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1995-01-03 — — US disclosed
EP-0459913-B1 Composition comprising a novel alicyclic compound, a process for the preparation thereof, a curable composition, and a photo-polymerizable composition DAICEL CHEM (JP) 1994-07-27 — — EP disclosed
EP-0540027-A2 Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-05-05 — — EP disclosed
US-5198509-A Curable composition with epoxy groups and esters DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-03-30 — — US disclosed
US-5169965-A Heat-curable or photocurable compounds; coatings; toughness; finishing; low-temperature cure DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-12-08 — — US disclosed
EP-0466596-A2 Lactone-modified alicyclic composition, and an epoxidized composition thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-01-15 — — EP disclosed
EP-0459913-A2 Composition comprising a novel alicyclic compound, a process for the preparation thereof, a curable composition, and a photo-polymerizable composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1991-12-04 — — EP disclosed
EP-0135887-B1 PHOTOCURABLE COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-04-06 — — EP disclosed
JP-S6071629-A MATERIAL FOR PHOTO-SETTING PLASTIC MOLD TOSHIBA CORP 1985-04-23 — — JP disclosed
JP-S6071630-A PHOTOSETTING EPOXY RESIN COMPOSITION FOR ARTISTIC ORNAMENT TOSHIBA CORP 1985-04-23 — — JP disclosed
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