SCHEMBL865896

SCHEMBL865896

OC=CC=CCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15355935 1.00
SCHEMBL14591148 0.97
SCHEMBL28238062 0.88
SCHEMBL1077458 0.84
SCHEMBL1077459 0.84
SCHEMBL29415161 0.84
SCHEMBL5868490 0.81 TSHR (0.33)
SCHEMBL5868492 0.81 TSHR (0.33)
SCHEMBL8648594 0.73
SCHEMBL8648591 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4829123-A ACRYLATED RESINS, URETHANE COMPONENT NIPPON GOHSEI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1989-05-09 US claimed
EP-3950755-B1 COMPOSITION AND HEAT CONDUCTING MATERIAL FUJIFILM CORP (JP) 2025-12-03 EP disclosed
US-12448555-B2 Composition for forming thermally conductive material, thermally conductive material, and surface-modified inorganic substance FUJIFILM CORPORATION (JP) 2025-10-21 US disclosed
US-12421426-B2 Composition, thermally conductive sheet, and device with thermally conductive layer FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
US-12391859-B2 Composition for forming thermally conductive material, and thermally conductive material FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3919540-B1 COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, AND THERMALLY CONDUCTIVE MATERIAL FUJIFILM CORP (JP) 2025-07-23 EP disclosed
EP-4036174-B1 COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER FUJIFILM CORP (JP) 2025-05-21 EP disclosed
WO-2025094502-A1 ADHESIVE COMPOSITION, AS WELL AS ADHESIVE SHEET, LAMINATE, AND PRINTED WIRING BOARD CONTAINING SAME 東洋紡エムシー株式会社 2025-05-08 WO disclosed
WO-2025075021-A1 BUMPY RESIN SHEET デンカ株式会社 2025-04-10 WO disclosed
CN-113228263-B Composition, heat conductive sheet, and device with heat conductive layer 富士胶片株式会社 2025-02-14 CN disclosed
EP-2189496-A1 CROSSLINKING AGENT, CROSSLINKED POLYMER AND THEIR USES The Nippon Synthetic Chemical Industry Co., Ltd. (JP) 2010-05-26 EP disclosed
US-20100086799-A1 Removal method, adhesive agent for substrate, and laminate including substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-08 US disclosed
EP-1285742-B1 Optical film, method of manufacture thereof and sheet polarizer SEKISUI CHEMICAL CO LTD (JP) 2008-10-08 EP disclosed
US-20070259284-A1 Capsulated toner SHARP KABUSHIKI KAISHA (JP) 2007-11-08 US disclosed
US-6888018-B2 ORGANOMETALLIC COMPOUND HAVING HIGH METATHESIS ACTIVITY AND METHOD FOR PREPARATION THEREOF, METHATHESIS REACTION CATALYST COMPRISING THE COMPOUND, METHOD OF POLYMERIZATION USING THE CATALYST, AND POLYMER PRODUCED BY THE METHOD OF POLYMERIZATION SEKISUI CHEMICAL CO., LTD. (JP) 2005-05-03 US disclosed
US-20040015002-A1 Novel organometallic compound having high metathesis activity and method for preparation thereof, metathesis reaction catalyst comprising the compound, method of polymerization using the catalyst, and polymer produced by the method of polymerization SEKISUI CHEMICAL CO., LTD. (JP) 2004-01-22 US disclosed
EP-1334977-A1 NOVEL ORGANOMETALLIC COMPOUND HAVING HIGH METATHESIS ACTIVITY AND METHOD FOR PREPARATION THEREOF, METATHESIS REACTION CATALYST COMPRISING THE COMPOUND, METHOD OF POLYMERIZATION USING THE CATALYST, AND POLYMER PRODUCED BY THE METHOD OF POLYMERIZATION SEKISUI CHEMICAL CO., LTD. (JP) 2003-08-13 EP disclosed
EP-1285742-A2 Optical film, method of manufacture thereof and sheet polarizer SEKISUI CHEMICAL CO., LTD. (JP) 2003-02-26 EP disclosed
US-20030031848-A1 Optical film, method of manufacture thereof and sheet polarizer SAWADA TAKAHIKO (JP) 2003-02-13 US disclosed
US-4829123-A ACRYLATED RESINS, URETHANE COMPONENT NIPPON GOHSEI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1989-05-09 US disclosed