Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Sulfuric Acid SCHEMBL3220895 | 0.95 | — | — | |
| Sulfuric Acid SCHEMBL7526263 | 0.95 | — | — | |
| Sulfuric Acid SCHEMBL6657 | 0.95 | — | — | |
| Sulfuric Acid SCHEMBL8512750 | 0.90 | — | — | |
| Sulfuric Acid SCHEMBL5267107 | 0.90 | TSHR (0.90) | — | |
| Sulfuric Acid SCHEMBL155382 | 0.90 | — | — | |
| Sulfuric Acid SCHEMBL2814092 | 0.90 | — | — | |
| Sulfuric Acid SCHEMBL8603601 | 0.90 | — | — | |
| Sulfuric Acid SCHEMBL10617315 | 0.90 | — | — | |
| Sulfuric Acid SCHEMBL1943982 | 0.90 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 229 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118892837-B | NiO@CuO/ZnO composite catalytic material and preparation method and application thereof | 兰州大学 | 2024-12-06 | — | — | CN | claimed |
| CN-118892837-A | NiO@CuO/ZnO composite catalytic material and preparation method and application thereof | 兰州大学 | 2024-11-05 | — | — | CN | claimed |
| CN-117769151-A | Method for manufacturing ultra-fine FPC | 上达电子（黄石）股份有限公司 | 2024-03-26 | — | — | CN | claimed |
| CN-117276345-A | Method for manufacturing silicon carbide semiconductor device | 株式会社电装 | 2023-12-22 | — | — | CN | claimed |
| CN-115769342-A | Substrate processing method and substrate processing apparatus | 株式会社斯库林集团 | 2023-03-07 | — | — | CN | claimed |
| CN-114843188-A | Method for forming semiconductor structure | 中芯国际集成电路制造(上海)有限公司 | 2022-08-02 | — | — | CN | claimed |
| CN-111669906-B | Method for manufacturing multilayer circuit board | 上海美维电子有限公司 | 2022-06-24 | — | — | CN | claimed |
| CN-216687786-U | Hydrogen peroxide decomposition device for hydrogen peroxide sulfate etching solution | 广东鑫菱环境科技有限公司 | 2022-06-07 | — | — | CN | claimed |
| CN-114180770-A | Hydrogen peroxide decomposition device and method for sulfuric acid hydrogen peroxide etching solution | 广东鑫菱环境科技有限公司 | 2022-03-15 | — | — | CN | claimed |
| CN-113257675-B | Preparation method of semiconductor device with high heat dissipation performance and semiconductor device | 智程半导体设备科技(昆山)有限公司 | 2022-02-01 | — | — | CN | claimed |
| CN-113257675-A | Preparation method of semiconductor device with high heat dissipation performance and semiconductor device | 智程半导体设备科技(昆山)有限公司 | 2021-08-13 | — | — | CN | claimed |
| CN-111377515-A | Method for decomposing hydrogen peroxide and apparatus using the same | 关东化学株式会社 | 2020-07-07 | — | — | CN | claimed |
| CN-111223862-A | Semiconductor device and method of manufacturing the same | 三星电子株式会社 | 2020-06-02 | — | — | CN | claimed |
| EP-1242315-B1 | COMPOSITION AND METHOD FOR TREATING POLLUTED WATERS AND WATER SEDIMENTS | PANNING FRANK (DE) | 2005-02-02 | — | — | EP | claimed |
| CN-1536031-A | Polycrystalline state composite and its preparation method | 陈书怡 | 2004-10-13 | — | — | CN | claimed |
| US-20020179539-A1 | Composition and method for treting polluted waters and water sediments | PANNING FRANK (DE) | 2002-12-05 | — | — | US | claimed |
| JP-1256193-A | — | — | None | — | — | JP | disclosed |
| JP-8078373-A | — | — | None | — | — | JP | disclosed |
| US-5486710-A | Field effect transistor | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1996-01-23 | — | — | US | disclosed |
| JP-H01256193-A | MANUFACTURE OF SMALL DIAMETER THROUGH HOLE SUBSTRATE | OKI DENSEN KK | 1989-10-12 | — | — | JP | disclosed |