SCHEMBL8679147

SCHEMBL8679147

[CH2]C(Cl)CC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7904650 0.73
SCHEMBL26981020 0.73 SLC22A6 (0.50)
SCHEMBL7820321 0.73 SLC22A6 (0.50)
SCHEMBL1262446 0.73 SLC22A6 (0.50)
SCHEMBL45165 0.73
SCHEMBL7024309 0.73
SCHEMBL35751 0.71
SCHEMBL29180593 0.71
SCHEMBL22575896 0.71
SCHEMBL28325056 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240117101-A1 COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, COMPOSITION FOR OPTICAL MEMBER FORMATION, RESIN FOR UNDERLAYER FILM FORMATION, RESIST RESIN, RADIATION-SENSITIVE RESIN, AND RESIN FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-04-11 US disclosed
US-20210331994-A1 COMPOUND, COMPOSITION CONTAINING THE SAME, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR FORMING INSULATING FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-10-28 US disclosed
US-20210309595-A1 COMPOSITION FOR FORMING OPTICAL COMPONENT, OPTICAL COMPONENT, COMPOUND, AND RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-10-07 US disclosed
US-20210206901-A1 COMPOUND, COMPOSITION CONTAINING THE SAME, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR FORMING INSULATING FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-07-08 US disclosed
EP-3842491-A1 COMPOUND, COMPOSITION CONTAINING THE SAME, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING INSULATING FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-06-30 EP disclosed
EP-3831882-A1 OPTICAL COMPONENT-FORMING COMPOSITION, OPTICAL COMPONENT, COMPOUND, AND RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-06-09 EP disclosed
EP-3062151-B1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYPHENOLIC COMPOUND FOR USE IN THE COMPOSITION, AND ALCOHOLIC COMPOUND THAT CAN BE DERIVED THEREFROM MITSUBISHI GAS CHEMICAL CO (JP) 2021-05-05 EP disclosed
US-20210070727-A1 COMPOUND, RESIN, COMPOSITION AND PATTERN FORMATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-03-11 US disclosed
US-20210070685-A1 COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-03-11 US disclosed
US-20200057370-A1 COMPOUND, RESIST COMPOSITION CONTAINING COMPOUND AND PATTERN FORMATION METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-02-20 US disclosed
EP-3051350-A2 ALCOHOLIC COMPOUND AND METHOD FOR PRODUCING ALCOHOLIC COMPOUND MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-08-03 EP disclosed
US-20160176840-A1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYPHENOLIC COMPOUND FOR USE IN THE COMPOSITION, AND ALCOHOLIC COMPOUND THAT CAN BE DERIVED THEREFROM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-06-23 US disclosed
US-20160145231-A1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYPHENOLIC COMPOUND FOR USE IN THE COMPOSITION, AND ALCOHOLIC COMPOUND THAT CAN BE DERIVED THEREFROM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-05-26 US disclosed
US-20140248561-A1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYPHENOLIC COMPOUND FOR IN THE COMPOSITION, AND ALCOHOLIC COMPOUND THAT CAN BE DERIVED THEREFROM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-09-04 US disclosed
EP-2743769-A1 RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYPHENOL COMPOUND USED THEREIN, AND ALCOHOL COMPOUND CAPABLE OF BEING DERIVED THEREFROM Mitsubishi Gas Chemical Company, Inc. (JP) 2014-06-18 EP disclosed
US-5770340-A USING ELECTROGRAPHIC PRINTING PLATE HAVING ELECTROCONDUCTIVE SUPPORT WITH PHOTOCONDUCTIVE LAYER CONTAINING INORGANIC PHOTOCONDUCTOR, SPECIFIC SENSITIZING DYE AND BINDER, ALSO WITH BACKING HAVING LOW ELECTRICAL RESISTANCE FUJI PHOTO FILM CO., LTD. (JP) 1998-06-23 US disclosed
US-5677098-A USING CYANINE DYE FUJI PHOTO FILM CO., LTD. (JP) 1997-10-14 US disclosed
EP-0288083-B1 Method of image formation which includes scanning exposure process FUJI PHOTO FILM CO LTD (JP) 1994-08-10 EP disclosed
US-4929527-A DARK CHARGE RETAINING PROPERTIES FUJI PHOTO FILM CO., LTD. (JP) 1990-05-29 US disclosed
EP-0288083-A2 Method of image formation which includes scanning exposure process FUJI PHOTO FILM CO., LTD. (JP) 1988-10-26 EP disclosed