⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10482151 | 0.79 | — | — | |
| SCHEMBL5831854 | 0.75 | — | — | |
| SCHEMBL4432081 | 0.75 | — | — | |
| SCHEMBL39995 | 0.74 | — | — | |
| SCHEMBL13002881 | 0.72 | — | — | |
| SCHEMBL31236822 | 0.72 | — | — | |
| SCHEMBL11414753 | 0.70 | — | — | |
| SCHEMBL3909902 | 0.70 | — | — | |
| SCHEMBL3920580 | 0.70 | — | — | |
| SCHEMBL3916049 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 258 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12097481-B2 | Process for preparing metal organic frameworks having improved water stability | MOF Technologies Limited (GB) | 2024-09-24 | — | — | US | claimed |
| CN-117924775-A | Solid OCA coating release film and preparation method thereof | 深圳市睿华涂布科技有限公司 | 2024-04-26 | — | — | CN | claimed |
| EP-3661895-B1 | PRE-IMPREGNATED FIBRE-REINFORCED COMPOSITE MATERIAL | PETROCERAMICS S P A (IT) | 2023-12-20 | — | — | EP | claimed |
| EP-3661999-B1 | PRE-IMPREGNATED FIBRE-REINFORCED COMPOSITE MATERIAL AND MANUFACTURED ARTICLE OBTAINED BY FORMING AND COMPLETE CURING OF SAID PRE-IMPREGNATED FIBRE- REINFORCED COMPOSITE MATERIAL | PETROCERAMICS S P A (IT) | 2023-09-20 | — | — | EP | claimed |
| CN-111164134-B | Prepreg fiber-reinforced composite material and article of manufacture obtained by molding and fully curing the prepreg fiber-reinforced composite material | 派特欧赛拉米克斯股份公司 | 2023-08-11 | — | — | CN | claimed |
| US-11655191-B2 | Pre-impregnated fibre-reinforced composite material and fibre-reinforced composite ceramic material, obtained by forming and subsequent pyrolysis of said pre-impregnated material | PETROCERAMICS S.P.A. (IT) | 2023-05-23 | — | — | US | claimed |
| US-11577477-B2 | Pre-impregnated fibre-reinforced composite material and manufactured article obtained by forming and complete curing of said pre-impregnated fibre-reinforced composite material | PETROCERAMICS S.P.A. (IT) | 2023-02-14 | — | — | US | claimed |
| US-11473637-B2 | Preform for making a component of a braking system | FRENI BREMBO S.P.A. (IT) | 2022-10-18 | — | — | US | claimed |
| CN-114434708-A | Preparation method of ETFE release film for IC chip | 河南源宏高分子新材料有限公司 | 2022-05-06 | — | — | CN | claimed |
| CN-114274626-A | Functional multilayer co-extruded fluororesin composite film and preparation method thereof | 天津新兴东方临近空间航天科技有限公司 | 2022-04-05 | — | — | CN | claimed |
| EP-2537165-A1 | FERROMAGNETIC POWDER COMPOSITION AND METHOD FOR ITS PRODUCTION | Höganäs AB (SE) | 2012-12-26 | — | — | EP | claimed |
| EP-2485840-A1 | METHOD FOR PRODUCING AN SI-BOUND FLUIDIZED-BED CATALYST | BASF SE (DE) | 2012-08-15 | — | — | EP | claimed |
| US-20120203045-A1 | PROCESS FOR PRODUCING AN SI-BONDED FLUIDIZED-BED CATALYST | BASF SE (DE) | 2012-08-09 | — | — | US | claimed |
| WO-2011101276-A1 | FERROMAGNETIC POWDER COMPOSITION AND METHOD FOR ITS PRODUCTION | HÖGANÄS AB (SE) | 2011-08-25 | — | — | WO | claimed |
| WO-2011042451-A1 | METHOD FOR PRODUCING AN SI-BOUND FLUIDIZED-BED CATALYST | BASF SE (DE) | 2011-04-14 | — | — | WO | claimed |
| EP-1833924-B1 | SURFACE MODIFIED CORUNDUM AND RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2009-08-19 | — | — | EP | claimed |
| US-7566500-B2 | highly thermal conductive filler; Corundum coated with a silicone containing at least one of methylmethoxysiloxane or ethoxydimethylsiloxane; electronic part or semiconductor element which transmits heat through the resin | SHOWA DENKO K.K. (JP) | 2009-07-28 | — | — | US | claimed |
| US-20070264493-A1 | highly thermal conductive filler; Corundum coated with a silicone containing at least one of methylmethoxysiloxane or ethoxydimethylsiloxane; electronic part or semiconductor element which transmits heat through the resin | SHOWA DENKO K.K. (JP) | 2007-11-15 | — | — | US | claimed |
| EP-1833924-A1 | SURFACE MODIFIED CORUNDUM AND RESIN COMPOSITION | SHOWA DENKO KABUSHIKI KAISHA (JP) | 2007-09-19 | — | — | EP | claimed |
| WO-2006062210-A1 | SURFACE MODIFIED CORUNDUM AND RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2006-06-15 | — | — | WO | claimed |