Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HMGCR | P04035 | 1/20 | 0.39 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.39 |
| ▸ | TBXA2R | P21731 | 1/20 | 0.39 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.38 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.38 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.34 |
| ▸ | CPT2 | P23786 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | FFAR3 | O14843 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL869495 | 1.00 | HMGCR (0.39) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| SCHEMBL19433049 | 0.89 | HMGCR (0.44) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| SCHEMBL869483 | 0.89 | HMGCR (0.44) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| SCHEMBL868389 | 0.89 | HMGCR (0.44) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| SCHEMBL870444 | 0.89 | HMGCR (0.44) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| SCHEMBL29434481 | 0.87 | HMGCR (0.37) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| T-Butylacetic Acid SCHEMBL813827 | 0.83 | HMGCR (0.42) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| SCHEMBL869890 | 0.82 | HMGCR (0.46) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| SCHEMBL869582 | 0.82 | HMGCR (0.46) | HMGCRCHRM1TBXA2RADRA1ACYP2C19 | |
| SCHEMBL869206 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | claimed |
| CN-118255944-A | Resin composition, composite material, and cured product thereof | 株式会社力森诺科 | 2024-06-28 | — | — | CN | disclosed |
| CN-117136175-A | Recess filling material kit, cured product thereof, and recess filling method | 株式会社力森诺科 | 2023-11-28 | — | — | CN | disclosed |
| CN-116917249-A | Recess filling material kit, cured product thereof, and recess filling method | 株式会社力森诺科 | 2023-10-20 | — | — | CN | disclosed |
| WO-2022224988-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT OF SAME, AND RECESS FILLING METHOD | 昭和電工株式会社 | 2022-10-27 | — | — | WO | disclosed |
| WO-2022224989-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND METHOD FOR FILLING RECESS | 昭和電工株式会社 | 2022-10-27 | — | — | WO | disclosed |
| CN-114846032-A | Radical polymerizable resin composition and cured product thereof | 昭和电工株式会社 | 2022-08-02 | — | — | CN | disclosed |
| CN-114829432-A | Radical polymerizable resin composition and cured product thereof | 昭和电工株式会社 | 2022-07-29 | — | — | CN | disclosed |
| CN-109071777-B | Composition for carbon fiber-reinforced resin, carbon fiber-reinforced resin composition, and cured product | 昭和电工株式会社 | 2022-06-10 | — | — | CN | disclosed |
| CN-114269848-A | Composition for forming heat conductive material, heat conductive sheet, and device with heat conductive layer | 富士胶片株式会社 | 2022-04-01 | — | — | CN | disclosed |
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | disclosed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | disclosed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |